BIOGRAPHY
Distinguished Fellow & Vice President, Research and Development Taiwan Semiconductor Manufacturing Company, Ltd.
Education:
Ph.D. Materials Engineering, Georgia Institute of Technology, USA
Experience:
Distinguished Fellow, Pathfinding for System Integration Technology
Vice President, Integrated Interconnect & Packaging Technology, TSMC
Honors:
Member of NAE
President Science Prize
IEEE EPS Rao Tummala Award
TSMC Distinguished Fellow, IEEE Fellow
Bio:
Dr. Douglas Yu is Vice President of Pathfinding for System Integration at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division.
Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives.
Prior to joining TSMC, Dr. Yu was a Member of Technical Staff and Project Leader at AT&T Bell Labs in USA, working on sub-micron process, device and integration technologies R&D from 1987 to 1994.
Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013, and received the Presidential Science Prize of Taiwan in 2017, the IEEE EPS Outstanding Manufacturing Technology Award in 2018, TSMC Distinguished Fellow in 2021, IEEE EPS Rao R. Tummala Award (technical field award) in 2022, and a member of NAE (National Academy of Engineering, USA) in 2023. He has received more than 1,500 US patents while serving at TSMC.
Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and Ph.D. in Materials Engineering from Georgia Institute of Technology.