downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

Dr. GamotaBIOGRAPHY

Dan Gamota was recenlty appointed as incoming Executive Director of NextFlex. 

Dr. Gamota has more than 25 years of experience leading large organizations such as Jabil, where he served as Vice President, and Motorola, where he served as Director & Fellow of the Technical Staff, both of which industrialized innovative products and deployed advanced microelectronics manufacturing operations to international high volume production sites. He is recognized for leading R&D and collaborative innovation teams spanning Semiconductor Foundry (middle end of line and backend of the line), Semiconductor Assembly, Packaging & Test, Complex Integrated Systems Assembly, and Printed Circuit Board Assembly operations. Dr. Gamota is a proven P&L leader of global engineering, operations, and business teams that developed, deployed, and sustained microelectronics-based product manufacturing that resulted in revenue growth, expanded margins, and increased free cash flow.

Dr. Gamota has a strong record being awarded and leading several multi-member microelectronics systems solutions development programs (DARPA, NIST ATP, etc.). He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council, providing strategic technology, market, and workforce development guidance. Also, Dr. Gamota is active in and has chaired committees developing microelectronics guidelines, standards, and roadmaps for IEEE, iNEMI, IPC, IEC, A*STAR, and SEMI.

Dr. Gamota was elevated to a NextFlex Fellow, IEEE Fellow, and was named a Dan Noble Fellow at Motorola for his contributions and leadership in microelectronics design, materials, packaging, processes, manufacturing, assembly, and testing. He earned a Ph.D. in engineering from the University of Michigan and a Master of Business Administration from the Kellogg School of Manageent at Northwestern University.