Showing 10249 - 10260 of 11421
Member Company
DAIKIN INDUSTRIES,LTD.
Fluoro plastics/elastomersEtching agents,Fluorocarbon etching gases
Member Company
Shenzhen Qingyi Photomask Limited
研究设计，生产经营新型显示组件（平板显示及显示屏），新型光掩膜版材料，LCD辅助设计软件开发和销售自主开发的软件产品。
SEMI Press Release
First Quarter 2016 Silicon Wafer Shipments Increase Quarter-Over-Quarter
SAN JOSE, Calif. — May 16, 2016 — Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon...
Member Company
Jiangsu Xinhua Semiconductor Technology Co., Ltd.
半导体材料、电子材料、高纯材料及副产品的研发、制造、销售及技术服务、咨询服务；自营和代理各类商品及技术的进出口业务（国家限定经营或禁止进出口的商品或技术除外）（依法须经批准的项目，经相关部门批准后方可开展经营活动）。
Member Company
JP Morgan Securities Japan Co., Ltd.
SEMI Press Release
SEMI Reports 2015 Semiconductor Photomask Sales of $3.3 Billion
SAN JOSE, Calif. — May 9, 2016 — SEMI reports that the worldwide semiconductor photomask market was $3.3 billion in 2015 and is forecasted to reach $3.4 billion in 2017. After increasing 3 percent in...
Member Company
AOI Electronics Co.,Ltd.
AOI Electronics is a leading company of Semiconductor Package, from Advanced Fan-Out Laminate Package (FOLP®) to Legacy Packages, such as SOP and QFN/DFN.
Customer can receive advantages by...
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Heterogeneous Integration Roadmap
2019 Edition | 2021 Edition | 2023 EditionFollowing SIA's closure of ITRS activities in 2015, the Heterogeneous Integration Roadmap activities continued -- sponsored by...
Member Company
Crest Systems (M) SDN BHD
Crest was founded in 1999 specialising in optical microscopy, microfocus x-ray inspection system and failure analysis solution provider. Since its inception, Crest Group of companies has grown to a...
Member Company
SIP TECHNOLOGY (M) SDN. BHD.
SIP Technology Corporation, provides the advanced semi-conductor manufacturing line, the SMT product equipments and supplementary materials of electronics industry for electronics manufacture service...
Member Company
SoftMEMS LLC
SoftMEMS sells powerful, easy to use CAD tools for the co-design and modeling of products and systems including MEMS and sensors, packaging and electronics. Software functionalities encompass mixed...