Showing 9757 - 9768 of 11410
Event Presentation
MSTC 2018
Member Company
Doosan Corporation Electro-Materials
Blog
All Ears: What’s Up Doc? 8 Podcast Picks for the Savvy Digital Medicine Listener
Do you email your doctor when you have a tickle in your throat? Wear a fitness tracker or use an app to monitor your sugar levels, exercise or nutrition? If so, congratulations! You are a part of the...
SEMI Press Release
First Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter to Record Level
Milpitas, Calif. — May 14, 2018 — Reaching their highest recorded quarterly level ever, worldwide silicon wafer area shipments jumped to 3,084 million square inches during the first quarter 2018, a...
Blog
Foundries Ramp FD-SOI, VLSI Survey Shows Why – More Highlights from the Silicon Valley SOI Symposium (Part 2)
Good news: there are far fewer bigoted extremists out there when it comes to FD-SOI vs. FinFETs. People want the best technology for their application. It's that simple. That's a key piece of news...
Member Company
Jiangsu Taizhi Technology Co., Ltd.
Blog
Integration with Global Ecosystem Key to Growth of China's Semiconductor Industry
The growth of China’s semiconductor industry outstripped sector expansion in many other regions in 2017 thanks in part to heavy government investments and supportive state policies. But China’s chip...
Blog
45 Years of SEMI Standards
Thanks to you and the more than 5,000 other industry experts who contribute your time and brainpower, the SEMI Standards Program is celebrating its 45th anniversary in 2018. The first SEMI Standards...
Blog
Is it the End for New Volume Fabs in the U.S.?
Can it be that no more new semiconductor fabs are being built in the U.S.?The last new volume fab known is Micron’s Building 60 in Utah, according to the SEMI World Fab Forecast report published in...
Member Press Release
Picosun aims for even stronger growth with bridge financing while preparing to be listed
ESPOO, Finland, 8th May, 2018 – Picosun Group, a leading provider of ALD (Atomic Layer Deposition) thin film coating technology for global industries, has decided of minimum one and a half million...
Member Press Release
GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED
GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED
Team from ESIEE Paris and Sorbonne University Awarded Grand Prize for Innovative use of MEMS and Mixed-Signal Design in 3D Vibration Energy Harvester...