Showing 8941 - 8952 of 11409
Event Presentation
EUV Patterning: Challenges and Opportunities
Frederic Lazzarino, R&D Manager, IMEC, discusses EUV industry trends and outlook. Topics include cost, EUV readiness, HVM implementation and more.
SMC Korea 2019 - Seoul, Korea
Event Presentation
Wet-Chemical Process Challenges for Advanced Logic Device Fabrication
Dr. Dennis H van Dorp, Sr. Researcher of Surface and Interface Chemistry outlines the wet process challenges associated with Advance Logic Device Fabrication. Areas of focus include high aspect...
Event Presentation
Advanced Transistor Evolution - Technologies for 5 nm and Beyond
Naomi Yoshida, Director, Distinguished MTS at Applied Materials, discusses trends and challenges associated with scaling beyond 5nm. She also provides insight on new technologies that allow for...
Blog
SEMI High Tech U Launches in Southeast Asia at SEMICON SEA 2019
On May 8, a group of students gathered at SEMICON Southeast Asia for a one-of-a-kind experience. These students would be the first in the region to participate in SEMI High Tech U (HTU) – diving into...
Event
SMC Korea 2019
Blog
Timing of Next Upturn? A Forecast
The typical winter “seasonal slowdown” is now behind us. What can we expect as the year progresses?
First Quarter Results
Global electronic equipment shipments were up 2.2% in April 2019...
Blog
SiV SOI Symposium Part 3 – Final FD-SOI Takeaways
Why FD-SOI? What can you do with it that you couldn’t do
before? That was the big question from IHS Markit’s Matthew Short that kicked
off the first panel discussion at the SOI Consortium’s Silicon...
Member Press Release
Trymax Receives Multi-System Orders from a Top 10 Semiconductor Packaging House
Multi-site shipment in Taiwan and China for 200mm and 300mm bumping descum solutions.
NIJMEGEN, THE NETHERLANDS - May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma...