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陽程科技成立於1981 年，累積四十餘年的自動化機電系統整合經驗，擁有專業的專案設計群，並不斷地提昇系統及設備維護能力，積極於LCD、PCB、CCL、 半導體、物流自動化等相關事業做全方位的規劃、設計及製造，努力的成果奠定陽程在自動化設備製造業的領導地位。產品完全為國內自行研發、 自創品牌，並設有2000...

Burn-in and Testing, DIP, SOP, CFP, BGAi , GFN, GSP, LGA, KGD (Load Board), Prober Card, Interface & docking systems for Adapter for IC Programmer.

Focus on process integration analysis and abnormal event detection by providing total solutions. Improve equipment property rate and process yield.

Small Automatic Grinding/Polishing MachineGrinding Width: 76~170mmSpeed: up to 5m/minMachining Examples: Ceramic substrate, Glass substrate, Molding substrate, QFN de-flash, Pre-mold lead frame,...

Total consulting service for customers to develop new products complying with Environment and Safety regulations

普兴电子式专业的外延材料供应商，专注于硅、锗硅及就变硅等外延材料的研究、开发、生产和销售。 Poshing is a professional provider of epitaxial materials. It specializes in the research, development production and marketing of various epitaxial...

We focus on equipment integration service and technical service in the fields of semiconductor, micro-assembly and electronic assembly. we provide professional services in the fields of hybrid...

1. Smart Microscope metrology measurement. With Auto loader, EFEM system, fully automatic metrology machine. 2. 3D confocal / Brightfield metrology measurement. With Auto loader, EFEM system, fully...

(1)Specialized semi-equipment provider in de-voiding by pressure oven for wafer & package assembly.(2)Patented curing process, unique know how for DAP, DAP,CUF,Solder paste, NCP, NCF& silicon...

Analysis/Measurement: Wafer, Die Bond, Wire Bond and Post-mold Inspection and Data Analysis software for process control. Automated X-ray Wire Bond, Die and Clip Voids Detection Software. Bonding...