Showing 8209 - 8220 of 8245
Member Press Release
IC’Alps joins X-FAB design & supply chain partner network to better support X-FAB’s customers with ASIC development
Meylan, FRANCE – February 12, 2021 – IC’Alps, French expert in design and supply of application-specific integrated circuits (ASIC), today announced it has joined the design and supply chain partner...
SEMI Press Release
SEMI and TechWorks Sign Multi-year Agreement to Accelerate Electronics Design and Manufacturing Innovations
BERLIN, Germany – April 10, 2019 – SEMI, the industry association representing the global electronics manufacturing and design supply chain, and TechWorks, the industry association for the deep tech...
Member Press Release
PNI Sensor Gives Parking Operators Greater Visibility Over Parking Space Inventory
PNI Sensor Gives Parking Operators Greater Visibility Over Parking Space Inventory
New PlacePod Vehicle Counting sensors accurately count vehicles entering and exiting parking facilities and...
Member Press Release
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as...
Member Press Release
Picosun’s ALD encapsulation prevents electronics degradation
ESPOO, Finland, 14th February 2019 – Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, reports unprecedented results in high...
Member Press Release
Cleanliness suitability of operating material
Dust particle or outgasing can make a complete batch unusable. That's why some industries must work under "clean" conditions. But what does "clean" or "cleanliness suitability" mean and how can it be...
Member Press Release
MRSI Systems Announces "One Stop Shop" Die Bonding Solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 --
MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at...
SEMI Press Release
Annual Silicon Volume Shipments Remain at Record Highs
Revenues continue to be under pressure
MILPITAS, Calif. — February 6, 2017 — Worldwide silicon wafer area shipments increased 3 percent in 2016 when compared to 2015 area shipments according to the...
SEMI Press Release
Another Record Year for Silicon Wafer Shipment Volumes in 2015
SAN JOSE, Calif. — February 9, 2016 — Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG)...
SEMI Press Release
Semiconductor Equipment Sales Forecast: $37 Billion in 2015 and $38 Billion in 2016
TOKYO, Japan — December 15, 2015 — SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015, according to the SEMI Year-end...
Member Press Release
Photon Control Announces Graduation to Toronto Stock Exchange
Photon Control Announces Graduation to Toronto Stock Exchange
Vancouver, BC, May 24, 2018 – Photon Control Inc. (“Photon Control” or the “Company”) (TSX-V: PHO), a leading developer...
Member Press Release
Technic Announces US Distributor Partnership with OrigaLys ElectroChem
Cranston, RI USA – Technic has announced an agreement with OrigaLys ElectroChem of Lyon France for distribution of their product line to the US market. OrigaLys manufactures an extensive line...