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SEMI Press Release
SEMI Taiwan President Terry Tsao Named SEMI Chief Marketing Officer
MILPITAS, Calif. – January 7, 2019 – SEMI, the global industry association serving the electronics manufacturing supply chain, today appointed SEMI Taiwan president Terry Tsao chief marketing officer...
Member Press Release
Key innovation to speed up key part of new product introduction process
Leading Yield Management Service provider, yieldHUB announced the launch of their latest tool: yieldHUB Characterize. This powerful new module speeds up a key part of the New Product Introduction...
SEMI Press Release
Standards Industry Leaders Honored at SEMICON West 2018
SAN FRANCISCO, Calif. — July 11, 2018 — SEMI yesterday honored two industry leaders at SEMICON West 2018 for their outstanding accomplishments in developing Standards for the electronics...
Member Press Release
Palomar Technologies Offering Silver Sintering to Meet the Needs for RF GaN Power Amplifiers
CARLSBAD, CA – December 3, 2018 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, today announced new epoxy...
Event
Compound Semiconductor Materials & HB-LED China TC Chapter Fall Meeting
SEMI International Standards Program
Compound Semiconductor Materials & HB-LED China TC Chapter Fall Meeting 2020
Monday, September 28, 2020
13:30-16:00
Yiwu, Zhejiang,...
Member Press Release
Picosun’s ALD yttria eliminates corrosion in demanding applications
ESPOO, Finland, 25th February 2019 – Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, has developed an excellent quality ALD...
Member Press Release
MRSI Launches new MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering...
SEMI Press Release
ESD Alliance Expands Global Platform at SEMICON China, DATE 2019, ES Design West
AI Smart Applications and IC Design Featured Topics at Executive Sessions
MILPITAS, CALIF. – March 14, 2019 – The Electronic System Design Alliance (ESD Alliance), a SEMI Strategic Association...
Member Press Release
Picosun launches new PicoMEDICAL™ solutions specially targeted for healthcare industries
ESPOO, Finland, 9th October 2018 – Picosun Group, a leading, global provider of ALD (Atomic Layer Deposition) thin film coating technology, strengthens its position in the healthcare market with new...
Member Press Release
Well established advanced packaging manufacturer in Taiwan selects Trymax
NIJMEGEN, The Netherlands (March. 02, 2018) - Semiconductor equipment manufacturer Trymax announced today that a Taiwanese establishes advanced packaging manufacturer selects Trymax for their...
SEMI Press Release
2019FLEX Japan and MEMS & Sensors Forum to Spotlight IoT, Smart Transportation and MedTech
TOKYO – March 12, 2019 – More than 300 industry experts and thought leaders will gather May 22-23 in Tokyo’s Shinagawa District at the co-located 2019FLEX Japan and MEMS & Sensors Forum for...
Member Press Release
Picosun’s ALD solutions make quality watches tick
ESPOO, Finland, 26th July, 2018 – Picosun Group, a leading supplier of advanced Atomic Layer Deposition (ALD) thin film coating solutions, solidifies its position in the watchmaking market with...