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MSEC 2026 Speaker Abstract & Bio - Frank Backes
Quantum Advantage in Orbit: Enabling Trusted Timing, Awareness, and Data Sovereignty in Space ABSTRACTThe quantum advantage is no longer theoretical—it's operational.Space demands certainty....
Event
Liquid Chemicals Japan TC Chapter Meeting
Liquid Chemicals Japan TC Chapter Meeting Date: Thursday, January 29, 2026Time: 3:00 pm - 5:30 pm JSTVenue: SEMI Japan Office + OVTCCM (Hybrid) AGENDA Standards Contact...
Member Company
Jiangsu ESTURD Packaging Group Co., LTD.
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Silicon Valley + Northeast Virtual Forum Bio - Duncan Meldrum, PhD
BIOGRAPHYDuncan Meldrum is a business economist who specializes in economics applications and forecasting for clients in the electronic materials, semiconductor equipment, and manufacturing...
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Silicon Valley + Northeast Virtual Forum Bio - Joe Gaustad
BIOGRAPHY
Joe has over 10 years of experience in Semiconductor as a Wet Process Development Engineer and OEM Product Manager. Currently he leads the Product and...
Blog
EDA—Giving Design and Manufacturing the Capability to Predict How a Design Will Perform
Presentations from SEMICON West’s “The Convergence of Semiconductor Manufacturing and Design” offer great insights into the collaboration between the two, as I was recently reminded by presenter...
SEMI Press Release
SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability
Policy Priorities Focus on Trade, Workforce, Investment Certainty, CHIPS Act Implementation, and Supply Chain ResilienceMILPITAS, Calif. — January 28, 2026 — SEMI, the industry association serving...
Member Press Release
OXFORD INSTRUMENTS TEAMS WITH AOI TO BOOST ITS OPTOELECTRONIC DEVICE MANUFACTURING WITH NEXT-GEN INDIUM PHOSPHIDE
Oxford Instruments, a leading provider of advanced plasma processing solutions, today announced a plasma equipment supply agreement with Applied Optoelectronics Inc. (AOI) (Nasdaq: AAOI), a leading...
Member Press Release
EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI
LOS ANGELES (Jan. 28, 2026) – EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC)....