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Event
ESD Alliance Webinar - Understanding Export Regulations Affecting the Electronic System Design Ecosystem
Join us at the ESD Alliance webinar to hear Larry Disenhof's perspective and invaluable insights into today's export climate and learn how to navigate export regulations. Free registration for...
Member Company
Automotive Industry Action Group (AIAG)
The Automotive Industry Action Group (AIAG) is a unique not-for-profit organization where OEMs, suppliers, service providers, government entities, and individuals in academia have worked...
SEMI Press Release
Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
MILPITAS, Calif. — September 14, 2021 — Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to...
SEMI Press Release
MSEC 2021 to Highlight Leading-Edge MEMS and Sensors Innovations as IoT Spending Surges
Event to Explore Opportunities in Medical, Space Exploration, Telecommuting, Community Infrastructure, and Other Growth Markets
MILPITAS, Calif. – September 14, 2021 – Returning to a live...
Page
SMC 2021 Bio - Matthew Kolb
Matthew Kolb was born and raised in Port Jefferson Station, Long Island, New York. He is a 2003 graduate of the United States Naval Academy where he earned his commission as a military officer and...
Blog
Deploying Artificial Intelligence at the Edge: Key Takeaways from SEMI CTO Forum
Rapid advances in artificial intelligence (AI) have made this technology important for many industries, including finance, energy, healthcare, and microelectronics. AI is driving a...
Blog
Retention Key to Winning Talent War
As we round the corner on 2021, the microelectronics industry continues to face a severe talent crisis. With more than 34,000 jobs remaining unfilled at SEMI member companies in the United States...
Member Press Release
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135) on...
Event
FHE Japan TC Chapter Meeting
FHE Japan TC Chapter Meeting
Date: Monday, September 13, 2021
Time: 15:00-17:00[JST]
via Web Conference
AGENDA
Standards Contact Information:
Mami...
Page
SMC 2021 Bio - Mauro J. Kobrinsky PhD
Mauro J. Kobrinsky received his PhD from the Massachusetts Institute of Technology in 2001. He has been with Intel’s Components Research for 20 years; his current position is Director of...
Member Press Release
Legal proceedings initiated against RoodMicrotec GmbH regarding perpetual bond
Deventer, September 9, 2021 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, announces that it has been informed by Prime Capital Debt SCS, SICAV-FIS...
Member Company
Nexensor Inc
Nexensor provides metrology solutions specialized in semiconductor and advanced packaging processes, based on high-precision 3D optical measurement technology. By applying advanced optical technology...