Showing 5749 - 5760 of 8233
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Ross Bundy
Ross Bundy is responsible for operations at Cardea. With an MBA from San Diego State University, Ross has held positions in supply chain, operations and finance at companies such as General Dynamics...
Event Presentation
OLED Micro-displays for VR/AR Applications
Qi Wang from Emagin Corporation discusses emerging Micro-Display technologies in the VR/AR segments.
SEMICON China 2019 - Shanghai, China
Member Company
SIEGERT WAFER GmbH
“SIEGERT WAFER, headquartered in Aachen, Germany, has been a reliable wafer supplier since 2002. We serve a diverse clientele, including industrial companies, universities, research laboratories, and...
Member Company
上海芯上微装科技股份有限公司
上海芯上微装科技股份有限公司（英文名称：AMIES Technology Co., Ltd.）注册于2025年2月。芯上微装是一家专注于高端半导体装备研发、生产和服务的创新型科技企业。公司以“推动国产半导体装备技术的发展，赋能全球芯片产业”为使命，致力于为“超越摩尔”赛道的芯片制造、芯片先进封装、三代半导体和新型显示等核心领域提供高精度、高性能、高可靠性的设备解决方案。
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SMC 2022 Bio - David Bloss, Intel Corporation
David A. Bloss is Corporate Vice President in Manufacturing Supply Chain and Operations and the General Manager, Global Sourcing for Equipment and Materials at Intel Corporation. He...
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SMC 2020 Speaker Bio - Priya Mukundhan
Priya Mukundhan is the Director, Thin Films Product Management at Onto Innovation. She previously held the position of Director of Metrology Products at Rudolph Technologies. Priya has a...
Event Presentation
Nokia, Connecting a Smarter World Smarter world を実現するノキアのソリューション
John Harrington, CEO and President, Nokia Solutions & Networks G.K. presents on connectivity.
SEMICON Japan 2019 - Tokyo, Japan
Event Presentation
Yahoo! Programs Report from 2019FLEX Japan
This report in Japanese is an overview of the presentation from Yahoo! at the 2019Flex Japan event in May of 2019.
Event Presentation
2019 SEMI UPDATES
HD Cho, President of SEMI Korea, discusses Korean member growth, SEMI product portfolio and technology platforms, workforce development, and the overall outlook of the electronics...
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Kevin Lite
Kevin Lite is a 23 year veteran of the silicon wafer industry, having worked in materials characterization, applications engineering and strategic marketing roles at Siltronic. He is currently the...
Event Presentation
A Tutorial In Two Parts 1. The Heterogeneous Integration Roadmap 2. System Level Integration Will Drive Fundamental Change in Manufacturing
Bill Bottoms Ph.D. discusses the history of integrated components and changes in manufacturing.
ASMC 2019 - Saratoga Springs, NY
Blog
Interview with Informatique News (France)
April 9, 2019Une interview de Carlos Mazure, CTO de SOITEC et Président du SOI Industry ConsortiumUne interview de Jean-Éric Michallet, responsable du département micro-électronique du LETI