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SEMI Press Release
Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter
MILPITAS, Calif. — September 10, 2019 — Worldwide semiconductor manufacturing equipment billings reached US$13.3 billion in the second quarter of 2019, down 20 percent from the same quarter of 2018...
SEMI Press Release
First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19 Percent Year-Over-Year
MILPITAS, Calif. — June 3, 2019 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today reported that worldwide semiconductor manufacturing...
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Terry Tsao
Terry Tsao is a seasoned executive and industry leader, currently serving as the Global Chief Marketing Officer and President of Taiwan at SEMI. In his current capacity, Terry Tsao assumes the...
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SPCC 2026 Bio Edwin Samayoa
Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging StructuresABSTRACTIn electronic packaging, Solder Paste Reflow process is routinely used to attach capacitors on a chip to copper pads...
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MEMS & Sensors Technical Congress—MSTC 2025 Speaker Bio & Abstract - Debra Deininger
Climate, Sustainability and Extreme Weather Events – Can we use Semiconductor Sensors and Data to Improve Outcomes?ABSTRACT Recent years have seen an unfortunate increase in wildfires, with...
Member Press Release
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high...
Member Press Release
Picosun to introduce novel coating solution for organic electronics
ESPOO, Finland, 14th of December 2021 - There has been a need for enhanced coating methods in organic electronic manufacturing as foldable phones and other future product iterations need materials...
SEMI Press Release
SEMI 3D & Systems Summit Opens – Highlights Advanced Packaging for Emerging Technologies
DRESDEN, Germany — 27 January, 2020 — The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications...
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Market Data Reports
Blog
Critical Subsystems Orders Fall Off a Cliff
Orders for critical subsystems evaporated in the second half of 2018 after a very strong start to the year. Subsystems suppliers have been left with depleted order books after OEMs accumulated large...
SEMI Press Release
SEMI Europe Applauds the European Commission’s Implementation Dialogue on the Chips Act 2.0
BRUSSELS – March 26, 2026 – SEMI Europe today participated in the European Commission’s Implementation Dialogue on the Chips Act, chaired by Henna Virkkunen, Executive Vice-President of the European...
Event
[PDS] Professional Development Seminar—Texas State University
[PDS] Professional Development Seminar
—Organized by SEMI Texas Chapter
—Collaboration with Texas State University
This IN-PERSON seminar features an agenda that will help students meet the...