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SEMI SEA SLS 2024 October Presentation Materials
Thank you for attending Semiconductor Leadership Summit 2024 October at Suntec Singapore Convention & Exhibition Centre!Please find the approved slides for distribution below. We hope you have...
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Northeast Fall Forum 2024 - Mark Halfman
BIOGRAPHYMark Halfman is the Director of the Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech). The NEMC Hub is a network of over200...
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Northeast Fall Forum 2024 - Dan Pulver
BIOGRAPHYDan Pulver is the manager of the Microelectronics Laboratory and the Advanced Technology Division Quality Management System.Pulver came to the Microelectronics Laboratory in 2014 after...
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MSEC 2024 Speaker Bio and Abstract - Martin Mallinson
Sensor Domain Signal ProcessingABSTRACTADCs have improved but haven't fundamentally changed for decades. Neural Networks and AI teach us new methods of processing data and SiliconIntervention uses...
SEMI Press Release
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework
MILPITAS, Calif. –– September 30, 2024 –– Seeking to strengthen the semiconductor industry’s resilience to cybersecurity threats, the global association SEMI today announced the creation of a...
Member Press Release
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high...
Member Company
Lumentum Japan, Inc.
Photonic products for cloud data centers and AI/ML.
High-performance industrial lasers used in automobiles, solar cells, displays, and semiconductor chips.
3D sensing applications used in mobile...
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ITPC Speaker Bio - Jaesik Lee
BIOGRAPHYDr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation...
SEMI Press Release
Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
MILPITAS, Calif. — September 26, 2024 — Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, SEMI highlighted today in its quarterly 300mm...
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FEMC#21 Navigating the Legal Landscape: AI Litigation Risks in Semiconductor and Medtech Recording
In this webinar, Jenny Colgate and Mark Rawls, experienced “high technology” litigators, explore the emerging legal challenges posed by artificial intelligence in both the semiconductor and medtech...
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ITPC Speaker Bio - Terry (Tetsuro) Higashi
BIOGRAPHYTETSURO HIGASHI is the first Chairman of the Board of Directors at Rapidus Corporation, a company that researches, develops, designs, manufactures, and sells advanced logic semiconductors,...