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Member Press Release
Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology...
SEMI Press Release
SEMICON Korea 2020 Keynotes to Highlight Future of AI
SEOUL, South Korea – January 14, 2020 – Semiconductor industry innovators SK hynix, Intel, imec and Graphcore will kick off SEMICON Korea 2020 with keynotes focusing on the future of artificial...
Blog
PCM/MRAM Workshop by Leti and Applied Materials During 2019 IEEE Intl. Memory Workshop
Two of the big, recent breakthroughs in memory technology – eMRAM and ePCM – have gotten their start in volume manufacturing on 28nm FD-SOI. In conjunction with the 2019 IEEE International Memory...
SEMI Press Release
Worldwide Silicon Wafer Shipments Set New Record in Q2 2022, SEMI Reports
MILPITAS, Calif. — July 28, 2022 — Worldwide silicon wafer area shipments in the second quarter of 2022 surpassed the previous record high set in the first quarter of the year, edging up 1%...
Member Press Release
Bioh Kim Joins YES Senior Executive Team as President of YES Korea
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Bioh...
Blog
Heads Up! S3S (SOI+) Conference w/FD-SOI Design Short Course, 14-17 October 2019, San Jose
The 45th (yes!) IEEE SOI Conference takes place 14-17 October 2019 in San Jose. Now called S3S –since it also covers 3D and subthreshold – it’s a networking event par excellence: a unique opportunity...
Member Press Release
Beneq Unveils Beneq Transmute™ – High-Throughput ALD for Power, RF, and μLED Device Production
New platform delivers ALD film quality at production throughput for Wide Bandgap and other specialty device manufacturing
Espoo, Finland, November 19, 2025 – Beneq, a global leader in Atomic Layer...
Page
MSEC 2024 Speaker Bio and Abstract - Neil Sarkar
Smart Glasses with Eye Tracking: The Optimal Front-End for AI AssistantsABSTRACTFor AI assistants to provide relevant guidance, they must be aware of a user’s context, as perceived by the user. For...
SEMI Press Release
ASMC 2024 to Spotlight Advanced Semiconductor Manufacturing Innovations and Excellence
MILPITAS, Calif. — February 12, 2024 — Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in manufacturing enabling AI and advancing...
SEMI Press Release
North American Semiconductor Equipment Industry Posts September 2021 Billings
MILPITAS, Calif. — October 21, 2021 — North America-based semiconductor equipment manufacturers posted $3.72 billion in billings worldwide in September 2021 (three-month moving average...
SEMI Press Release
North American Semiconductor Equipment Industry Posts April 2019 Billings
MILPITAS, Calif. — May 21, 2019 — North America-based manufacturers of semiconductor equipment posted $1.91 billion in billings worldwide in April 2019 (three-month average...
SEMI Press Release
2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
MILPITAS, Calif. — September 12, 2023 — Global fab equipment spending for front-end facilities in 2023 is expected to decline 15% year-over-year (YoY) to US$84 billion from a record...