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Oral History Interview: Sam Harrell
SEMI Oral History Interview
Sam Harrell
Interviewed by Craig Addison, SEMI
Sam Harrell served as senior vice president of strategic business development for KLA...
Event
Pacific Northwest Chapter Breakfast Forum
Organizer: SEMI Pacific Northwest ChapterIN-PERSON + VIRTUAL8:00–11:45am Pacific Time (PT)
Member Press Release
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5...
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ITPC 2019 - Paul Burlingame Bio
PAUL BURLINGAME
President and CEO
Air Liquide Advanced Materials
Paul was appointed President & Chief Executive Officer of Air Liquide Advanced Materials in 2013 and is responsible for...
Member Press Release
Picosun launches a new ALD product platform for up to 200 mm wafer markets
SEMICON West, SAN FRANCISCO, CA, USA, 9th July 2019 – Picosun Group, the leading provider of AGILE ALD™ (Atomic Layer Deposition) thin film coating solutions, has launched PICOSUN™ Morpher, a new ALD...
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Oral History Interview: John Robinson & Mike Grimes
SEMI Oral History Interview
John Robinson & Mike Grimes
Texas Instruments (retired)
Interviewed by Craig Addison, SEMI
John Robinson
John Robinson joined...
Member Company
Ningbo HONGXIN NEW MATERIAL Technology Co. LTD
Shanghai hongjun founded in 2008, is a collection of scientific research, production, sales, installation, service as one of the high-tech enterprise. The main products are ingot graphite parts,...
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ITPC 2019 - Debbie Gustafson Bio
DEBBIE GUSTAFSON
CEO
Energetiq Technology
Debbie Gustafson is the Chief Executive Officer of Energetiq Technology, Inc. and a member of its board of directors. Ms. Gustafson joined the...
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Oral History Interview: Jerry Hutcheson
SEMI Oral History Interview
Jerry Hutcheson
Founder, VLSI Research
Interviewed by Craig Addison, SEMI
Jerry Hutcheson joined the electronics industry in 1959...
Blog
pSemi: World’s First Monolithic SOI Wi-Fi FEM
pSemi (formerly Peregrine, now a Murata company) has staked its claim for having the world's first monolithic SOI Wi-Fi front-end module (FEM)—the PE561221. This 2.4 GHz Wi-Fi FEM is the first to...
Member Press Release
Elevate Your Tray-Based Inspections with our Latest Configuration – the AUX 4S+ Inspection Module!
PENANG, MALAYSIA - OCTOBER 2023 Curious about how Integrated Circuit (IC) manufacturers keep pace with fast-changing technology? Discover how automated systems are revolutionising the semiconductor...