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Blog
Sensors Help Bring Smart Manufacturing to Existing Fabs – Takeaways from SEMI GSMC
As semiconductor device manufacturers investigate digitalization of existing and new plants, they are focusing on new sensing technologies that can increase wafer throughput, reduce downtime, boost...
Member Press Release
NexAIoT will join QualityLine’s AI data integration solution to set the new standard in manufacturing operations.
NexAIoT will join QualityLine’s AI data integration solution to set the new standard in manufacturing operations.
Technology will serve industries looking for a full transparency monitoring solution...
Blog
Enabling Co-Packaged Optics at Scale: The Critical Role of Wet Processing in Photonics Manufacturing
As artificial intelligence (AI) workloads surge and hyperscale data centers expand, the semiconductor industry is confronting fundamental limits in electrical interconnects. Co-packaged optics (CPO)...
Member Press Release
DuPont to Discuss Development of EUV Photoresists at SPIE Advanced Lithography + Patterning Conference
WILMINGTON, Del., Feb. 12, 2025 – DuPont today announced its participation in the 2025 SPIE Advanced Lithography + Patterning conference, taking place Feb. 24–28 in San Jose, California. DuPont will...
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Gurtej Sandhu, PhD
Gurtej Sandhu is Senior Fellow and Vice President at Micron Technology. In his current role, he is responsible for Micron’s end-to-end (Si-to-Package) R&D technology roadmaps. The scope includes...
Blog
Sensing the World: Innovating to Create a More Connected Future
With the rapid proliferation of electronics applications with more powerful embedded intelligence, demand for smarter, more efficient sensors is increasing to help devices connect to the world around...
Blog
SOI in IoT & Automotive (Japan event summaries, part 2)
Here is our second post about the SOI Consortium’s Japan Symposium this past fall. This will provide summaries of eight very informative presentations on SOI in IoT and automotive by NXP, Dolphin...
Blog
The Evolving 5G NR: Connecting the Future
John Smee, VP Engineering, Qualcomm Technologies Inc., will share insights on 5G – which is evolving to enable more reliable connectivity with higher performance in and beyond the era of Internet of...
Blog
For Moore’s Law to Live, SoCs Must Die
Throughout the current millennium, System-on-Chip (SoC) has been the gold standard for optimizing performance and cost of complete electronic systems. By incorporating practically all the phone’s...
Blog
Automotive Trends: Chip Traceability, Zero Defects and Collaboration
Automotive original equipment manufacturers (OEMs) and their direct suppliers of parts and systems share a vision: Next-generation vehicles will be more electric, autonomous and connected. At a...
Blog
NanoIC Pilot Line: imec's Initiative Advancing Europe's Semiconductor Ecosystem
The semiconductor industry is undergoing a rapid transformation. Artificial intelligence (AI) applications, such as agentic and physical AI, push compute demands to unprecedented heights, prompting...