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Member Press Release
Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration...
SEMI Press Release
Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award
Dr. Pileggi Will be Recognized for His Significant Contributions to the Electronic System Design Industry
MILPITAS, Calif. – September 5, 2023 – Dr. Lawrence Pileggi, Coraluppi Head...
Blog
Unlocking New Possibilities in AI with Unity-SC: Insights from Merck KGaA, Darmstadt, Germany’s Kai Beckmann
As artificial intelligence (AI) continues to revolutionize industries, the technology behind AI chips is advancing at an unprecedented pace. Meeting the demands of faster processing, greater...
Blog
RFSOI Short Course - Great Line-Up! (EuroSOI, March 2018)
RF-SOI is in every smart phone out there, and with 5G, there are lots more applications on the horizon. If you’d like to learn more about designing in RF-SOI, there’s a great short course coming up...
Blog
SEMI SMC 2019: Rising to the Chip Challenges of a Connected World
The semiconductor industry is in the final throes of its most recent cyclical downturn, but clear demand drivers on the horizon, such as 5G and autonomous driving, have created a decidedly upbeat...
Blog
More than Moore Devices: The Wind of Change
Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path...
Page
GSMS2021 AB Session 4
Moderators
Chungyuan Standard Time (CST)
Stephen Lee, Director for Early Innovation Partnering for North Asia, Johnson & Johnson Innovation
Biography: Stephen is responsible for...
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Dong-Su Kim, PhD
Dong-Su Kim, Ph.D. is the CEO of LG Technology Ventures. He has over twenty five years of investment, strategy, planning, and technology...
Member Press Release
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale
Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in...
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NBMC 07.17.13
SAN JOSE, Calif., July 17, 2013 -- The Nano-Bio Manufacturing Consortium (NBMC) has released its first Request for Proposals (RFP) focused on developing a technology platform...
Blog
Startups for Sustainable Semiconductors – 2023 Finalists Announced
Building on the success of the first year of Startups for Sustainable Semiconductors to spur more green technology innovation, SEMI launched the second year of the program in...