Strategic Materials Conference (SMC) Korea 2018: Challenges for Electronic Materials to Enable a Connected World

Mark Thirsk, Partner at Linx Consulting, discusses semiconductor market inflections and technology drivers such as IoT, AR/VR, and automotive applications, which call for architecture change, process needs, complex packaging, and 3D scaling. Structural trends, China’s involvement, and consolidation of companies are included. Materials trends, challenges, drivers, and opportunites and patterning trends in optical and EUV are covered. Additional charts and graphs are supplied. From Strategic Materials Conference in May 2018 in Korea.

Keywords: 3D NAND, AI, IoT, Mobile, Autonomous Vehicles, Trends, Fabrication, Materials, Deposition, Lithography, EUV