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Dan Tracy, Senior Director of Industry Research and Statistics at SEMI, gives a review of 2017, including an etch equipment surge due to 3D NAND and sub-20nm technology, and an outlook on 2018, including growth in fab investment (especially China). Packaging trends and transitions like FO-WLP, SiP, and TSV are discussed. Equipment and materials forecasts are supplied graphically. From SEMICON Korea in February 2018 in Coex, Seoul.

 

Keywords: Fabrication, Forecast, Trends, Materials, 3D NAND, DRAM, FO-WLP, SiP, TSV, Sensors, Substrate, Copper, Underfill