SEMICON Europa 2017: 3DIC Assembly at Room Temperature Employing Binary Alloying

Eric Schulte, CTO of SETNA Corporation discusses current bonding methods of 3D assembly and proposes a solution via Indium Silver Binary, going over the methodology, characterization, and evaluation of experimental results thus far. From SEMICON Europa 2017 in November in Munich, Germany.

Keywords: 3D IC, Indium Silver Binary, Wafer Bonding, Bonding, Characterization