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This collection contains presentations by Cassandra Melvin, Global Product Manager of Atotech, Gu Eric, Application Manager at Nordson ASYMTEK, Daquan Yu, Ph.D., of Huatian Group and Yichen Zhao of Sumacro, Xinglong Chen, CTO of Kingsemi, Ma Lisa, Technical Marketing Engineer at National Instruments, and anonymous speakers from CETC, NDS Dicing Service Center, Material Science Service Corporation, Cimetrix Incorporated, Kulick & Soffa, Suntific Materials (Weifang), Ltd., and Suorec, which were given during SEMICON China 2018 Smart Manufacturing conference in March in Shanghai, China.
“A New Tool for Next Generation Power Semiconductors” discusses HEV/EV market growth and requirements for automotive electronic systems, namely: high power density, temperature, power efficiency, CO2 reduction, and high reliability. Limitations of current power module packages is discussed, as well as new technology for embedding power modules and the features and challenges of each. The EmPower project is introduced, along with experimental results and a summary of technical benefits.
“Advanced Dispense Technology Introduction” discusses growth drivers and end markets of Advanced Technology Systems, such as precision dispensing, fluid management, and test, inspection, and surface treatment. Requirements for decreasing volumes, stream widths, and line widths, as well as increased placement accuracy (dots and lines) are discussed. ASYMTEK offers an integrated solution philosophy meshing fluid delivery and platform. Jetting technology and the Vantage Dispensing System are introduced. Nordson ASYMTEK’s mission is to be the leading worldwide supplier of solutionsfor the application of materials for assembly of semiconductor and electronic products.
“Front Line of Tono – New Chapter of Kaizo Domestic Production Machine” [Japanese only.]
“Dicing Fluids – The Key Element for Smart Dicing” discusses water as a traditional dicing fluid, and how the addition of CO2 reduces the formation of static charge, shortens blade life due, does not effectively remove debris, results in bonding failure, and increases Electrochemical corrosion. These challenges have let to future dicing fluids which will be designed and developed with specialty surfactants, anti-static charge agents, fast wetting agents, and effective lubricants and cooling agents. Experiments are shown on stains/oxidation, corrosion inhibition, surface tension, and blade life.
“New Technology Release – Huatian-Sumacro ‘Embedded Silicon Fan-Out (eSiRO) Technology and Product” discusses packaging developments as driven by applications in mobile, IoT, automotive, and big data, and a timeline of packaging technology is shown. Fan-in versus fan-out and applications are covered, as well as the process and results of eSiFO. Package-level and board-level reliability are detailed.
“FEOL Photo Track Technology – Latest Trends and Development” discusses the FEOL photo track market and improvements due to node shrinkage and yield requirements. KingSemi offers a portfolio of coater/baker/platform and services using photolithography.
“Inside of 10nm Technology Node” analyizes SRAM size/density, FinFET structure, SiGe versus Strain, and metal interconnection of advanced mobile phones in the market. Logic transistor density is shown graphically.
“Integrated Equipment Data Collection and Management for Smart Manufacturing” discusses smart manufacturing/Industry 4.0, factory stakeholders, equipment model value chain (control, connect, collaborate, visualize, analyze, optimize), SEMI standards support, integrated equipment data management and major system components, and gives application examples such as real-time throughput monitoring, precision FDC feature extraction, specialty sensor data access, fleet matching and management, eOCAP execution support, sub-fab data integration/analysis, and automated equipment characterization. An example is given.
“Lowering the Cost of Test while Improving Time-to-Market with a Platform-Based Approach – A Smarter Approach to Meet Test Needs in the Era of Smart Devices” discusses National Instrument’s history and PXI’s broad range of applications. Increasing complexity of wireless standards, higher level integration in RF front ends, cost reduction, common test needs (more functionality, high reliability, low cost, and fast time to market) have driven vendor strategies for test/measurement. Closed versus platform approach versus common platform (lab to production) is evaluated. Product offerings and examples are showcased. National Instruments mission is to equip engineers and scientists with systems that accelerate productivity, innovation, and discovery.
“New Ball Bonder Release” introduces Kulicke & Soffa (K&S), a global technology and market leader in semiconductor assembly equipment offering advanced interconnect solutions, advanced packaging, wire bonding, and dicing blades. The RAPID Pro is introduced, offering real-time process monitoring and advanced data analytics to ensure high yield, an enhanced control system for data collection and storage for traceability, and robust process performance to maximize productivity and simplify optimization. The OptoLux is introduced, offering faster bonding process and alignment.
“Technological Breakthrough – Environmental Conversion / Light Engraving” discusses wet etch, reactive ion etch, and implantation, as they relate to exposure latitude, depth of focus, line edge roughness, iso-dense bias, and critical demission. Suntific replacement technology in place of cyclized rubber photoresist shows benefits with its deactivation mechanism.
“The Application of TIMs in the Electronic Industry” discusses Thermal Interface Materials (TIMs) and the three modes of thermal transmission, namely: radiation, conduction, and convection. Fourier’s Law (the Principle of Heat Conduction) is applied in depth. Challenging characteristics are addressed, using different forms for the thermal interface, be they physical, solid, paste, liquid, or morphologic. The thermal gap pad and thermal putty are intoduced, along with features and usage for each. A detailed performance test is given upon physical/chemical attributes (hardness, density, viscosity), thermal conductivity and resistance, electrical attributes (dielectric breakdown voltage, surface/volume resistivity), and reliability. Lastly, application of TIMs is showcased in power supplies, LED lamps, security cameras, domestic appliances, mobile phones, and telecommunication base stations.
Keywords: Automotive, Transportation, MOSFET, Packaging, Advanced Packaging, Dicing, FO-WLP, SiP, China, Fabrication, EUV, Photolithography, Lithography, Throughput, FinFET, Interconnects, IoT, Characterization, RF, MEMS, Bonding, Optimization, Etching, Smart