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This collection contains presentations by Tomas Bauer, SVP Sales and Business Development at Silex Microsystems, Maurus Tschirky, Senior Manager of Project Marketing at Evatec Process Systems, Leopold Beer, Regional President at Bosch Sensortec, Shlomo Gadot, Founder and CEO of Inuitive, and an anonymous speaker from MEMSensing Microsystems, which were given during SEMICON China 2018 MEMS and Sensors Industry Group (MSIG) conference in March in Shanghai, China.
“Creating Large-Scale Manufacturing Intrastructure for the Sensory Revolution and IoT” gives a company introduction of Silex, its capabilities, capacity, and investment, as well as a MEMS Foundry market overview. Productification of MEMS calls for a protocol quite different from IC devices; custom ICs are compared to custom MEMS. Product offerings Sil-Via, Met-Via, and Met-Cap are introduced in detail. Electoplating and piezo MEMS are also covered.
“Emerging MEMS Industry in China” gives an industrial veteran’s perspective of how MEMS have evolved in scale, price, accuracy, and intelligence through innovations in etching, packaging, bonding, testing, and materials. Three types of business models are compared: IDM, fabless, and semi-fabless. Opportunites and challenges in academia, HR, industry, and business are identified. MEMSensing’s unique semi-fabless model is charted, along with its achievements.
“Sputter Deposition of Al(1-x)ScxN from R&D to High Volume Manufacturing” discusses Evatec’s 70 years of experience and innovation in the capital equipment industry and integrated solution provider of deposition technology/processes and sputtering & evaporation platforms (batch, cluster, inline) for advanced packaging, power, wireless, MEMS, optoelectronics, and photonics. Distribution and decentralization of intelligence through microprocessors, memories, and situational awareness bring opportunities in connectivity, power management, CPUs, and sensors. Evatec has shaped the state-of-the-art deposition of piezoelectric materials. Current market request, details on sputtering and deposition, stress adjustability/repeatability, piezoelectric properties, and crystallinity are shown graphically.
“The IoT Dilemma – And Ways Around It” discusses how MEMS are involved in automotive, consumer electronics, and IoT (and overlaps). IoT is a disruptive driving force where industries converge (mobility, entertainment, telecommunication, healthcare, industrial). Vision versus reality is considered, along with possible answers and lifecycle stages of devices. IoT offers a huge value opportunity if decentralized “value” can be centralized.
“The Roll of 3D Sensors, CV, Deep Learning, and AI in Future IoT Solutions” discusses IoT edge devices which offer stronger communication capabilities and local smarter sensing, computing, and analyzing capabilities– essentially, merging information from multiple sources. Human sensors versus machine sensors is considered to enable IoT edge devices to see, sense, and understand through 2D/3D imaging and Deep Learning. A smart sensor hub diagram is shown. Inuitive provides a comprehensive solution; Veronica, Twiggy, M3.2SP, and NU4000 are introduced, along with strengths.
Keywords: MEMS, Sensors, Deep Learning, AI, HVM, Deposition, TSV, RF, China, Etching, Bonding, Packaging, Advanced Packaging, Materials, Fabrication, Photonics, Thin Film, Piezoelectric, IoT, Automotive, Transportation, CMOS