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This collection contains presentations by Anshul Sarda, VP of Electronic Special Gases at the Linde Group, Seung Wook Yoon, Director of Group Technology Strategy at JCET (STATS ChipPAC Ltd.) and Dian Wang, Scientist at Calterah Semiconductor, Jinrong Zhao, President of Naura Technology Group Co. Ltd., and Wang Yu-Po, Ph.D., Director of SPIL, which were given during SEMICON China 2018 IC Ecosystem conference in March in Shanghai, China.
“Integrating Domestic and International Electronic Material Solutions” introduces the Linde Group and countries of operation, which leads the industry in industrial gases in Asia/Pacific. Established wafer fabs and announced locations in China are depicted. How gases are used in fabrication is explained, as well as key processes that use ESGs (deposition, lithography, etching, doping, annealing, cleaning). Supply models (on-site, bulk, cylinder) are shown. China has seen mega fabs, clusters of investment, and sustained government support, which has allowed for capacity growth and technological advancement in semiconductors. Variability of raw materials, precision of manufacturing, and supply chain management all have a hand in quality control.
“Advanced Wafer Level Packaging for mmWave Automotive Devices” gives an overview of automotive packaging, focusing on ADAS sensors and comparing radar, LiDAR, ultrasonic, and camera. Flipchip versus eWLB FO-WLP are compared; eWLB FO-WLP is a platform for 3D integration. eWLB FOWLP is the most attractive packaging solution for mmWave Radar application due to its best electrical intrinsic performance and its robust reliability. Due to technology limitations and dependency on foreign suppliers, fabless Chinese companies are underpenetrated by domestics OSATs. A success story is shared (CMOS 77GHz mmWave device with eWLB).
“Bold Chinese High-End Integrated Circuit Equipment / Large Power Equipment – Establish China’s High-End IC Equipment Industry” [Japanese only.] China’s semiconductor industry is flourishing and developing hand in hand, driving the development of NAURA. NAURA takes the concept of customer oriented to sustain innovating, based on Semiconductor process technology, exploring application of new technology, and make broad cooperation with downstream and upstream advanced enterprises, support technological progress of all kinds of new industry , to realize Win-Win development withdownstream partners.
“AI Packaging Applications and Solutions” introduces the company SPIL and its manufacturing facilities in China and Taiwan. Three elements of AI are discusses, including Algorithms, Data Analysis, and Hardware Coordination. The AI ecosystem includes the Cloud, networking, and edge devices in the IoT. Advanced Package Technology solutions include High Performance Computing (HPC), 5G Antenna in Package, and Wearable IoT Devices, each of which is covered in greater depth.
Keywords: Fabrication, Deposition, Lithography, Etching, Doping, Annealing, WLP, FO-WLP, AI, China, Investment, Supply Chain, Automotive, ADAS, Packaging, Sensors, Radar, LiDAR, MEMS, SiP, CMOS, Advanced Packaging, IoT, Cloud, Networking, Edge Devices, Wearable Devices, Smart