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This collection contains presentations by Vesa-Pekka Lempinen, Senior Manager of Customer Support at Okmetic, Andrea Rusconi Clerici, Co-Founder and Managing Director at USound, Antoine Filipe, CTO of Tronics Microsystems, Manuel Tagliavini, Principal Analyst at IHS Markit, Ian Roane, President & CEO of Micralyne Inc., Andreas Prümm, Product Manager at MEMS Inertial, Teng Gao, Ph.D., of Fiot-Lab, Mikko Utriainen, Ph.D., Senior Scientist and Business Development Specialist at VTT, Eric Mounier, Ph.D., Senior Analyst of Yole Développement, Bardia Pezeshki, CEO of Kaiam Corporation, Daniel Harel, Director of EPG PDC Product Management and RD&E at Applied Materials, David Springer, Product Manager at SPTS Technologies, Ludovic Laurent, R&D Engineer at MirSense, Christophe Kergueris, R&D Project Leader for Safran Colibrys, Markus Schindler, Ph.D., Product Manager at DELO Industrial Adhesives, Andrew Tweedie, Co-Founder of OnScale, Christian Mandl, Senior Director for Human Machine Interface at Infineon Technologies AG, Emmanuel Sabonnadière, CEO of Leti, Bruno Ghyselen, R&D of SOITEC, Benedetto Vigna, President of Analog, MEMS, and Sensors Group at STMicroelectronics, and Michael Alexander, Ph.D., Partner at Roland Berger, which were given at the European MEMS & Sensors Summit in September 2018 in Grenoble, France.
"Advanced Substrates for MEMS and Photonic Applications" discusses application areas for advanced SOI structures, such as pressure sensors and microphones, inertial sensors, optical devices, timing devices and resonators, ink jet heads and microfluidic devices, and silicon photonics. Additionally, substrate considerations for released MEMS structures are covered.
“Breaking the MEMS Micro Speaker Barrier” discusses MEMS speaker applications, technical and market entry challenges, and product reference designs.
“Challenges of MEMS Manufacturing for Industrial Markets: From Myth to Reality” discusses 15+ different sensing/actuation principles achieveable by MEMS products, key MEMS modules needed (such as lithography and thick-SOI), and how MEMS could be used for Industrial IoT applications like smart factories/power plants/warehouses.
“Disruption in the Authentication Sensor Market” discusses the global fingerprint sensor market, emerging display fingerprint sensors, light sensor market update, and time-of-flight for 3D sensing. Includes a multitude of graphs and charts.
“Embracing Design for Manufacturing in MEMS – Success and Disappointment” details Design for Manufacturing (DFM) as a means of addressing producibility issues early in the design cycle, and integrating manufacturing concerns and considerations into a design to obtain a more producible product. A comparision of customer experience between MEMS and ASIC industries are shown, along with a case study on micro-mirrors. Currently, MEMS product development processes today are inefficient, but MEMS technology platforms offer a standard and infrastructure to assist.
“Energy-Efficient IoT and Wearable Applications Enabled by the Ultra-Low Power MEMS Acceleration Sensor BMA400” showcases applications for the BMA400 such as activity tracking, smart home security systems, and smart indoor climate systems. Technical features are discussed in detail.
“Introduction of Sensor Ecosystem in China” discusses the supply market of China sensor industry and companies’ challenges. A history is given, sharing the two Bases of Research Institutes in China, emerging companies, and the influence due to the rise of the smartphone. MEMS opportunities in IoT applications and the MEMS industrial chain are also discussed. Fiot-Lab has been working to use MEMS for respiration monitoring, sleep monitoring, and shape detection.
“Lateral High Aspect Ratio (LHAR) Test Chips” discusses conformal thin films, atomic layer deposition, conformality characteristics, and use cases.
“Megatrends’ Impacts on the MEMS Business” discusses four megatrends, namely, smart automobiles, mobile, healthcare, and industry 4.0. It offers a forecast for MEMS and senors, as well as showcases new devices and applications. Comparisions of MEMS companies are given, along with many startups, as well as forty years of MEMS market entry history and a peak at what could be next.
“MEMS-Based Techniques for Alignment of Single Mode Hybrid Optics” discusses how MEMS are ideal for optical because of their use in small motions, force, and precision. VCSEL application is covered, with variations and newer versions HCG equiped. Data center interconnects, data center transceiver requirements, and approaches are also included.
“Metrology and Inspection − Ways to Address New Challenges and in the More than Moore Technology Environment” discusses the growth and increased stability of the industry as it has evolved into visual computing and AI needs. Inflections and challenges in regard to wafer handling, wafer substrate, and design/process are included. Defect review technology, wafer inspection, CD-SEM technology, and a case study are offered.
“Molecular Vapor Deposition (MVD) – A Versatile, Multifunctional Technology with Applications in MEMS, Packaging and Beyond” introduces MVD, its applications for MEMS and sensors, keys to MVD success, and process concepts. Film categories, such as SAM coatings, bio coatings, inorganic films, organic films, and optical films, film formation, coating situations, and barrier layer characteristics are included.
“MultiSense – A Breakthrough for Mapping & Sensing in Real Time Pollution” showcases the reduced size, reduced cost, and unpackaged laser of the MultiSense. “Next Generation MEMS Variable Optical Attenuators” introduces Safran’s core products and state-of-the-art processes. Trends in telecom and datacom optical MEMS are discussed, along with solutions, challenges, and next-gen MEMS VOA.
“Novel Materials for MEMS Packaging” discusses die attach adhesives and ASIC die encapsulation. Various applications, such as environmental, optical, actuators, and inertials are covered.
“Optimization of PMUT Fingerprint Sensor Arrays Using OnScale” discusses design challenges (performance, cost, reliability) and scalable cloud simulation to reduce physical prototypes and costly iteration that require intensive engineering.
“Sensors Enabling Smart HMI” covers the current limitations in the human machine interface, Infineon’s smart consumer sensors, and an example of positioning usecase.
“Sensor Technologies – Array Sensors is the New Frontiers of Technology” discusses sensor market drivers and trends, opportunities for new sensor developments, and recent developments in array sensors.
“Smart Cut Technology Applied to MEMS – Illustration in the Field of Ultrasonic Transducers” gives an introduction to cMUTS and pMUTs, Smart Cut techonology, and some MUT technical demonstrations. Many graphs and charts are provided to illustrate the technology.
“The Next Opportunity for MEMS – From the Consumer Market to High Volume Industrial and Automotive Markets” discusses the different requirements dependent upon the market the MEMS will be utilized in, such as personal electronics, automotive, and industrial. In particular, connectivity, condition monitoring, micro-mirrors, inertial navigation, automation, and sensor accuracy are covered.
“Future Trends and Drivers for Sensors Markets – The Sensor Users’ Perspective” discusses the sensor market based upon end-user industry, technology, and region. While all markets are experiencing significant growth, automotive is highest. Sensor demand is driven by mega-trends, sensor requirements, and supplier capabilities. IoT ecosystems will consolidate Sensor data from ever-increasing multiple sources for remote analytics. Sensors for the next generation identification require high-speed local analytics solutions for image and voice sensing. Next-generation UI/UXsensors strongly focus on precision & quality of measurement and capability to analyze data locally. Trends in Automotive and Consumer Electronics are converging; a consolidated ecosystem offers device aggregations and personalized paths to cross-industry services.
Keywords: Substrate, SOI, TSV, MEMS, CMOS, Lithography, IoT, Investment, Supply Chain, Forecast, Robotics, Autonomous Vehicles, Medical, Healthcare, China, Thin Film, Deposition, Trends, AI, CIS, Packaging, Materials, Encapsulation, Photonics, Optical, Microfluidics, ASIC, ALD, Smart, Industry 4.0, Interconnects, Metrology, Organic, Die Attach, Encapsulation, Optimization, Cloud, Market Research