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This collection contains presentations by Melissa Grupen-Shemansky, Ph.D., CTO of SEMI/FlexTech, Peter Hessney, President of Sensor Films Inc., Jennifer Colegrove, Ph.D., CEO and Principle Analyst of Touch Display Research, Raghu Das, CEO of IDTechEx, and Wanxin Sun, Application Manager at Bruker Nano Surface, which were given during the 2017 FLEX Southeast Asia convention in October in Singapore.
“Building the Flexible Hybrid Electronics Supply Chain Through Collaboration” shows a FHE system schematic, explaining how FHE merges the advantages of manufacturing options of semiconductors and printed electronics. The Medical, Environmental, and Transportation applications are boundless. SEMI, FlexTech, and NextFlex have been enabling the FHE industry ecosystem from market research to manufacturing since the 1970s. A construction of the R&D Consortia is given. An example is : the Hydration Patch.
“Challenges and Opportunities in Additive Manufacturing for Flexible Printed Electronics” discusses the future of printable electronics, challenges of adoption of innovations, opportunities of FHE, the complexity of inkjet printing; different substrates, different inks, different equipment must come together in an integrated process. The Starlight Manufacturing Platform is a single, multi-pass operation that is flexible and modular that performs 2.5D digital printing. NovaCentrix PulseForge 3200 and Universal Instruments Uflex are also compared.
“Flexible Display and Flexible Touch – Technologies and Market Forecast” discusses the flexible display technology market and drivers, including OLED investment and fabrication, Quantum dot TV forecast, flexible lighting, flexible touch panel technology market and forecasts, along with a business strategy recommendation. Many charts and graphs support the forecasts.
“Flexible, Hybrid & Printed Electronics – Markets, Technologies, Opportunities” discusses problems in the retail and packaging industry such as shrinkage and out-of-stocks, problems in healthcare such as shortage of doctors and improper storage of prescription drugs, problems with wearable technology, problems with vehicles/transportation such as improvements to electric vehicles and need for distributed sensors in autonomous vehicles, problems with consumer electronics and IoT such as need for customization and thinner, more robust, longer-life devices, and how flexible/printed electronics can address all these challenges. A value chain and recent investments/acquisitions supplied, along with information on screen printing and inkjet printing, printed and flexible sensors, 3D printed electronics, conductive inks, stretchable electronics, printed batteries, and energy harvesting.
“Mechanical and Electrical Properties Measurement on Flexible Electronics” shows the complexities of materials, process, and design involved in electronic devices today. Electric property measurement, conductive and tunnelling AFM, leaky contact characteristics, dielectric film breakdown, dielectric contrast, resistive switching, scanning capacitance microscropy, dopant profiling, CMOS image sesnor, environmental control, resolution, force induced phase transition, thin film mechanical properties, delamination and failure, porosity measurement, film hardness and adhesion, stress induced failure, BEOL stacking layers, chip packaging integration, and MEMS are also covered.
Keywords: FHE, Sensors, Thin Film, Substrate, Printed Electronics, Medical, Healthcare, Environmental, Automotive, Transportation, Autonomous Vehicles, MEMS, Materials, Additive Manufacturing, Sintering, R2R, OLED, Investment, Forecast, AMOLED, QLED, Interconnects, Packaging, Supply Chain, Fabrication, Wearable Devices, Conductive Inks, Lamination, CMOS