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Historical World Fab Report (2012 - 2023)

Provides high-level graphs and tables, down to quarterly details, and analyzes global semiconductor facilities and production lines in a 12-year report format.

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Current Edition:

April 2026

Publication Schedule:

Historical Report

Principal Analysts:

Chris Dieseldorff, SEMI

Format:

Microsoft® Excel® file (.xls)

This report provides high level graphs and tables, down to quarterly details, and analyzes global semiconductor facilities and production lines over a 12-year timeframe. The report captures information by production line, including demographics and fab owners, and also provides quarterly insights into spending for Front End facilities, from R&D to high volume production, covering areas such as fab equipment and construction, as well as production capacity, technology trends, product types, and wafer sizes. It also covers all facility milestones, from operation to closure. Covering over 1800 production lines, this report offers valuable data for understanding historical trends and making informed decisions.

The report uses a bottom-up approach, tracking projects per cleanroom facility but uses also a top-down analysis by company, region, and industry segment.

 

The information of the fab reports is compiled from a variety of industry sources, including news articles, publicly available data, capital spending plans, earnings reports, SEC filings, corporate presentations, announced fab projects, ramp schedules, and technology roadmaps.

 

We make every effort to contact each company directly to update and verify information whenever possible. In addition, we rely on our established global network and a variety of other trusted industry sources to confirm data. We also incorporate various economic indicators into our forecast modeling, including GDP, industry revenue, macroeconomic conditions, and individual company strategies.

 

Additionally, we benchmark our data against the Worldwide Semiconductor Equipment and Materials (WWSEMS) report to refine historical data and adjust our forecast model accordingly. The WWSEMS report, published monthly, provides billing figures from a wide range of participating equipment suppliers.

 

When direct verification is not possible, or information is incomplete or delayed, we apply best-educated estimates within our fab forecast model. This model tracks each fab project in detail—monitoring quarterly construction and equipment spending, production capacities, technologies, wafer sizes, and product types. As new information becomes available, we promptly update the data to maintain accuracy and reliability.

 

Key features:

  • Line-by-line details: Extensive data on individual facilities and production lines from R&D to high-volume fabs, including spending, capacities, product types, technology nodes, technology types, and wafer sizes.

     

  • Historical trends: Analysis of historical results and trends, presented in over 15 charts and over 70 analytical trend tables as well as analysis using pivot tables for spending and capacity by company, and fab starting construction and fabs starting operation.

     

  • Comprehensive coverage: Complete fab-cycle coverage from planning, construction, equipping, ramping, and closure.

     

  • Valuable insights: Quantitative analysis of the impact of semiconductor fab plans on demand and supply imbalances.

 

This report is an essential resource for industry professionals, financial analysts, and business intelligence experts, development agencies, governments and universities looking to understand the historical performance and trends in the semiconductor manufacturing sector.

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