"How and When State of the Art Si-Photonics will replace Chip-to-Chip Interconnect in VLSI"
- Enabling SiPh packaging features to unleash next gen C2C solutions in a Wild West World, Dan Berger, Senior Director of Advanced Silicon Packaging, GLOBALFOUNDRIES
- Transitioning to Integrated Optics, Brad Booth, Microsoft COBO
- Leveraging the benefits of co-packaged silicon photonics to meet future data center/HPC needs Seyedi Ashkan, Senior Research Scientist, Hewlett Packard Labs
- Path to co-packaged photonic I/O for large-scale chip-to-chip interconnect Thomas Liljeberg, GM Photonic Integration, Silicon Photonics Product Division, INTEL
- Si Photonics market perspectives: from pluggable transceivers to co-packaged switches ASIC Eric Mounier, Fellow Analyst, Yole Developpement
- Next Generation Optical I/O for Multi-Tbps Applications Prof. Vladimir Stojanovic, Chief Architect and Co-Founder, Ayar Labs
- Photonic Fully Integrated Circuits with large volume production capability Sylvie Menezo, CEO&CTO, SCINTIL Photonics
