Advancing Quality & Reliability of MEMS for Security & Safety Applications
MEMS & Sensor devices have been used for safety applications for 2 to 3 decades, but quality and reliability requirements continue to outpace capabilities. The electronics industry has not defined an advanced quality and reliability beyond the AEC Q100 and ZVEI Robustness Validation specifications. NXP is proposing an "Above and Beyond" methodology intended to 1) produce higher body of evidence to enable lower ppm resolution of stress testing, 2) run serial reliability testing to better evaluate failure mechanisms and produce physico-chemical models of these mechanisms, 3) test reliability stress-to-fail to enable reliability modeling of failure mechanisms, and 4) reliability test corner lots to understand the design-process-manufacturing space with respect to quality and reliability. In the presentation, NXP will propose a methodology for tailoring these 4 types of quality and reliability evaluation testing to MEMS/Sensor products and their intended use-cases: supply chain / assembly and end-user application. Moreover, NXP will promote adoption of this methodology as a means of addressing the continuously stricter requirements particularly related to the security and safety applications across markets.