SEMI China Equipment and Materials Committee Meeting Discussed Industrial Development Trends And Promoted Exchanges and Cooperation
By Cherry Sun, Marketing Manager, SEMI China
SEMI China Equipment and Materials Committee meeting was held June 12 in Hefei, Anhui Province. The event was sponsored by SEMI and hosted by Hefei High-tech Zone. Member enterprises of SEMI China Equipment and Materials Committee, including more than 60 attendees from global top equipment and materials manufacturers, gathered in Hefei to discuss the development and cooperation trend of semiconductor industry at home and abroad.
Lung Chu, President of SEMI China, introduced the development history and future trend of semiconductor industry in his welcome speech. At the same time, he also introduced that in addition to equipment materials, SEMI was constantly expanding in other areas of the industry chain, where SEMI integrated ESDA (Electronic System Design Alliance), FlexTech, FOA (Fab owners alliance) and MSIG (MEMS & Sensors industry group). SEMI hopes that the industry will continue to grow. Free trade, win-win cooperation, open market and protection of intellectual property rights are the consistent ideas of SEMI.
In order to help the industry attract more excellent semiconductor talents, "SEMI WFD China Advisory Council" cooperates with the semiconductor industry and government departments to ensure the innovation and sustainable development of semiconductor industry by attracting, retaining and training talents. It is reported that SEMI China will hold a WFD conference in the near future. In promoting the development of global semiconductor industry and China's semiconductor industry, SEMI has continuously gathered strength and actively organized rich activities to promote the sustainable growth of Chinese semiconductor enterprises through international cooperation.
Jay Chen, President of TEL China;, Zhang Guoming, Senior Vice President of NAURA; and Sun Jiangyan, Vice Chairman of Shanghai Sinyang, the three chairmen of the SEMI China Equipment and Materials Committee, gave a welcome speeches, respectively.
According to Jay Chen, TEL is the third largest equipment manufacturer in the world. China is TEL's largest market in the world, with a very good relationship with Chinese customers and industry. TEL will continue to provide high quality products and services to Chinese semiconductor industry within the scope of policy permission.
According to Zhang Guoming, under the current industrial environment, everyone attaches great importance to the issue of supply chain security. For the IC industry, cooperation is the best way. We should strive to promote cooperation in communication.
Sun Jiangyan said that no organization in any country would block the pace of another country and organization in the field of internationalization of the industry. The fact that you have me and I have you cannot be changed by anyone. According to her, first of all, we should unswervingly take the road of independent innovation and independent research and development in a down-to-earth manner. Secondly, we cannot give up international cooperation, as well as the cooperation and interaction of the industry. No matter what kind of political environment we are in, we all have the wisdom to come up with good cooperation solutions. The future trend is still a win-win cooperation.
The leader of Semiconductor Investment Service Bureau of Hefei High-tech Zone introduced the development of integrated circuit industry in Hefei and the whole high-tech zone. From the development of the industrial chain, traditional competitive industries in Hefei have been upgraded and developed continuously in the emerging industrial market. The market demand is very strong. Industry chain and consumption chain are integrated well by combining with many universities and human resources in Hefei and continuously introducing the technological research and development, thus building an ecosystem of integrated circuit industry in Hefei, which also requires the support of entrepreneurs for Hefei.
Tsai Hui-Chia, Operation VP of Nexchip, not only gave a detailed introduction to Hefei Nexchip, including project development milestones, product planning and technology orientation, but also mentioned the future capacity expansion plans.
Du Shanshan, senior analyst at SEMI China, introduced the development of global semiconductor and China's IC development opportunities. She pointed out that it was expected that there would be a slight recession in 2019 due to memory market adjustment, trade wars and other factors. But for the long term, the development trend of the semiconductor industry was still relatively optimistic. Du Shanshan also shared SEMI's prediction of equipment market, global wafer manufacturing material market and global equipment material market, in which the global material market is dominated by the Fab materials. Development opportunities of China's integrated circuits, such as the continuous optimization of industrial structure, the rapid growth of wafer manufacturing capacity, new Fab projects leading the world, the largest investments in memory and foundry and an increase in China-based Fab Capacity.
Xie Xinzhen, the GM of IFLYTEK hardware center, deputy general manager of IFLYTEK automotive business department, shared the development of IFLYTEK, Artificial Intelligence Development Platform, and IFLYTEK demand for chips. He said that AI had risen to a national strategy. In the era of AI+, three elements of AI that change the world include core technology, industry experts, and industry big data.
At the end of the meeting, the participants visited the IFLYTEK AI Laboratory, which impressed them with its smart application in education, home, automobile and robots. AI changes the world! AI creates the beauty of the world! Let's look forward to the meeting of SEMI China Equipment and Materials Committee in the second half of 2019.