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MILPITAS, Calif.  — June 29, 2020 — Industry leaders and visionaries will gather in virtual format August 24-26, 2020, for the SEMI Advanced Semiconductor Manufacturing Conference (ASMC) to provide the latest insights and developments across a wide range of critical industry topics from yield management to metrology in the era of artificial intelligence (AI). The conference will feature more than 35 hours of technical content – presented live and available on-demand – on leading-edge semiconductor manufacturing strategies and methodologies. Registration is now open.

ASMC 2020 Logo

The live panel discussion Exascalers, Hyperscalers: Computing at the Edge – Different Modes, Different Nodes will highlight the conference. Panelists will include experts from industry leaders including Applied Materials, Binghamton University, Corning, IBM Global Think Labs and Tercero Technologies. In addition, a tutorial presented by Intel and Entegris will focus on Contamination Control: Enabling High-Yield Manufacturing.

Now entering its fourth decade, ASMC is the premier event for industry professionals to network and share best practices for semiconductor manufacturing. The conference is co-chaired by Fred Bouchard of SpareTech and Armando Anaya of Northrop Grumman

ASMC 2020 Keynotes 

Thomas Sonderman Photo

Thomas Sonderman, President, SkyWater Technology

Sonderman will highlight requirements for manufacturing leadership in the AI era.

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Jesus del Alamo Photo

Jesus del Alamo, PhD, Donner Professor,

Professor of Electrical Engineering, MIT

del Alamo will discuss nanoscale III-V for sustained CMOS innovation.

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Robert Maire Logo

Robert Maire, Semiconductor Advisors

Maire will explore future market trends.

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ASMC 2020 technical tracks include:

  • Advanced Equipment Processes and Materials
  • Advanced Metal Structures
  • Advanced Process Control
  • Contamination-Free Manufacturing
  • Defect Inspection
  • Factory Optimization
  • Novel Metrology Techniques
  • Optical Metrology and Machine Learning
  • Patterning and 3D Metrology
  • Smart Manufacturing
  • Yield Enhancement/Yield Methodologies

For more conference details, contact Margaret Kindling at mkindling@semi.org or 1.202.393.5552. The media should contact Scott Stevens (for SEMI Americas communications) at scottstevens512@gmail.com for registration information.

SEMI Golden Anniversary

SEMI 50 Logo

2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate, innovate, and help transform the world with new technologies. 

Join us at SEMICON events around the world as we celebrate 50 years of growth in global electronics manufacturing and kick off the next 50 years by highlighting the latest developments, trends and innovations in smart technologies.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: scottstevens512@gmail.com