BIOGRAPHY
Joshua is a 3DI Process Engineer at TEL whose primary area of specialization is wafer-to-wafer (W2W) bonding. He has hands-on experience supporting hybrid and fusion bonding integration, combining his academic background in nanoscale engineering with practical experience in advanced semiconductor processing.
He holds Associate of Science degrees in both Engineering Science and Computer Science from Hudson Valley Community College, as well as a Bachelor of Science in Nanoscale Engineering from SUNY Albany. While completing his undergraduate studies, Joshua interned with TEL’s 3DI team, where he gained direct experience with wafer bonding processes and integration activities. This opportunity allowed him to apply his coursework in a professional semiconductor environment and provided the foundation for his transition into a full-time engineering role at TEL.
Joshua is currently pursuing a Master of Science in Nanoscale Engineering at SUNY Albany, further developing his knowledge of nanoscale technologies while expanding his experience in 3D integration and wafer bonding with TEL.