3D Universal Package for MEMS Gyroscopes and Accelerometers
ABSTRACT
Honeywell developed a universal MEMS sensor package to enable SWaP-efficient, high-performance inertial measurement units (IMUs). MEMS gyroscopes in the new package were tested in both the flat and edge mounted configurations. Performance results from both configurations compare favorably to a legacy package and will enable lower SWaP architectures. In addition, a new edge-mount package was designed as part of a co-packaging trade study, with the advantage of including a hermetic environmental seal and utilizing off the shelf COTS components for low noise front end amplifiers. Funding for the “3D Universal Package for MEMS Gyroscopes and Accelerometers” program PNT22-23-013 was provided to Honeywell International Inc: Aerospace Advanced Technology by SEMI.
BIOGRAPHY
Dr. Markus Gnerlich is a research scientist with 8 years of experience in MEMS inertial sensor design in Advanced & Applied Technology within Honeywell Aerospace. Prior to Honeywell, Dr. Gnerlich worked to integrate bio-templated electronics with a flexible substrate process as a Postdoctoral Research Associate at the MEMS Sensors and Actuators Laboratory at the University of Maryland. He received his Ph.D. in Electrical Engineering from Lehigh University while researching a MEMS Actuator and Sensor System for Measuring the Mechanical Compliance of Biological Cells.