Innovations in MEMS Wafer Bonding: Oxide-Free Heterogenous Material and Substrate Integration
As the complexity of MEMS and sensor devices increases, innovative manufacturing technologies become essential to fulfil the requirements of next-generation applications. Wafer bonding is already a key technology for MEMS and sensor encapsulation but is also becoming increasingly important for advanced system integration. This presentation will discuss latest developments in ultrahigh vacuum, oxide-free wafer bonding. The technology based on EVG´s ComBond® system offers covalent fusion bonding at room temperature, enabling heterogenous integration of various materials with different lattice constants and thermal expansion coefficients. While classical fusion bonding relies on oxide-oxide bonding, the ComBond® process removes surface oxides and allows for a seamless transition between two materials. As a result, highly electrical or thermal conductive interfaces can be realized as well as photonic sensor integration can benefit from optical transparent interfaces. The presentation will also cover new achievements in Die-to-Wafer (D2W) bonding, enabling oxide-free heterogenous substrate integration.
BIOGRAPHY
Dr. Bernd Dielacher is business development manager at EV Group (EVG) where he evaluates global market trends and develops growth opportunities for EVG's bonding, lithography and nanoimprint businesses with a particular focus on the heterogenous integration, MEMS, biomedical technology and power device market.
Bernd holds a master’s degree in Microelectronics from Vienna University of Technology and received a PhD in Biomedical Engineering from ETH Zurich.