BIOGRAPHY
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
- Stanford Graduate School of Business Executive Program, Stanford University
- PhD and MS, Mechanical Engineering, Louisiana State University
- BE, Mechanical Engineering, Maharaja Sayajirao University