downloadPath
Skip to main content

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

MEMS, sensors, automotive drive 200mm wafer processing

(EE News Europe - 14 Feb 2019)

200mm fabs to add 700,000 wafers through 2022, says SEMI

(DigiTimes - 14 Feb 2019)

Getting Ready For 32 GT/S PCIe 5.0 Designs

(Semiconductor Engineering - 14 Feb 2019)

Gearing Up For 5G

(Semiconductor Engineering - 14 Feb 19)

China's Chip Fab Capacity Rising Fast

(EE Times - 14 Feb 2019)

Global 200mm wafer processing on 3.9% CAGR
(EE News - 13 Feb 2019)

An update on TSMC's transition to 7nm EUV mass production and future plans
(TechSpot - 12 Feb 2019)

The “Wall,” political gridlock and China: SEMI’s take on SOTU address
(Solid State Technology - 12 Feb 2019)

200mm fabs to add 700,000 wafers through 2022, SEMI reports
(Solid State Technology - 12 Feb 2019

Trump Creates U.S. AI Initiative
(EE Times - 12 Feb 2019)

200mm Wafer Report Sees 14% Rise
(EE Times - 12 Feb 2019)

SEMI-FlexTech Issues 2019 Request for Proposals to Advance Flexible Electronics Ecosystem
(EMS Now -11 Feb 2019

Startup Accelerates AI at the Sensor
(EE Times - 11 Feb 2019)

5G’s Future Viewed from the Lab
(EE Times -11 Feb 2019)

IC Insights, SEMI far apart on significance of Chinese IC production
(EE News - 11 Feb 2019)

NIST: Blockchain Provides Security, Traceability for Smart Manufacturing
(NIST - 11 Feb 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering - 8 Feb 2019)

China's IC Production Forecast to Double Over Next 5 Years
(EE Times - 8 Feb 2019)

Flex Tech Effort Issues $5M Research Call
(EE Times - Feb 8 2019)

Apple, Qualcomm Fight Over Engineers
(EE Times - 7 Feb 2019)

The Race To Multi-Domain SoCs
(Semiconductor Engineering - 7 Feb 2019)

Complex Systems Need a Simple API
(EE Times -7 Feb 2019)

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council
(Solid State Technology - 6 Feb 2019)

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies
(Solid State Technology - 6 Feb 2019)

Huawei Was No. 3 Chip Buyer in 2018
(EE Times - 6 Feb 2019)

Samsung chief visits Xian seeking new memory strategy
(Korea Herald - 6 Feb 2019)

Intel Confirms Plans for Oregon Factory
(U.S. News & World Report - 5 Feb 2019)

Heterogeneous Integration Needs Tools, Models
(EE Times - 5 Feb 2019)

US Chipmakers Feel Pain When Wish Granted to Scrutinize China
(DataCenter Knowledge - 4 Feb 2019)

Chip Sales Slow, China Talks Start
(EE Times - Feb 4 2019)

Renesas to Cut 1,000 Jobs in Japan
(EE Times - 4 Feb 2019)

SEMI-FlexTech issues 2019 request for proposals to advance flexible electronics ecosystem
(Solid State Technology - 4 Feb 2019)

Skin-Like Biocompatible Devices Come to Market – and to FLEX/MSTCS
(Solid State Technology - 1 Feb 2019)

Uber Calls for AI Standard
(EE Times - 1 Feb 2019)

Japan to Hack 200 Million IoT Devices
(EE Times - 1 Feb 2019)

GlobalFoundries to Sell 200-mm Fab 3E to Vanguard, Exits MEMS Business
(AnandTech - 1 Feb 2019)

Samsung Electronics 4Q net profit slumps 31%
(Japan Today - 1 Feb 2019)

Smart Cars Drive 200mm Fabs
(EE Times - 31 Jan 2019)

Pushing AI Into The Mainstream
(Semiconductor Engineering - 31 Jan 2019)

Silicon shipments hit record high with revenues exceeding US$10 billion in 2018, says SEMI

(Digitimes - 31 Jan 2019)

Annual silicon shipments hit record high, market exceeds $10B for first time since 2008

(Solid State Technology - 30 Jan 2019)

Chip Gear Sales Fell in December
(EE Times - 29 Jan 2019)

Intel to Invest $10.9 Billion in New Israeli Fab
(EE Times - 29 Jan 2019)

China’s Foundry Biz Takes Big Leap Forward
(Semiconductor Engineering - 28 Jan 2019)

Here’s how tariff have impacted robotics and why it matters
(Tech Wire Asia - 28 Jan 2019)

Automotive-centric semiconductor players to drive tech sector
(The Edge Markets - 28 Jan 2019)

Augmented reality, IoT will transform manufacturing processes
(IIot World - 28 Jan 2019)

Weak China Demand Stings Intel
(EE Times - 25 Jan 2019)

China, Chips, and 2019 Still Unclear
(EE Times - 25 Jan 2019)

How to add machine intelligence or AI to EDA tools
(Solid State Technology - 25 Jan 2019)

Agile manufacturing of glass carriers for advanced packaging
(Solid State Technology - 25 Jan 2019)

A year of transformation and execution: Focus on creating member value
(Solid State Technology - 25 Jan 2019)

SEMICON Korea Highlights Smart Tech, Industry Growth and Workforce Development
(EMS Now - 24 Jan 2019)

What’s Next For AI, Quantum Chips
(Semiconductor Engineering - 24 Jan 2019)

Planning For 5G And The Edge
(Semiconductor Engineering - 23 Jan 2019

Blog Review: Jan. 23
(Semiconductor Engineering - 23 Jan 2019)

Chip Industry M&A Remains on the Decline
(EE Times - 23 Jan 2019)

The Data Deluge
(Semiconductor Engineering - 23 Jan 2019)

Planning For 5G And The Edge
(Semiconductor Engineering - 23 Jan 2019)

Samsung Electronics Increases Spending on Lobbying in the U.S.
(Business Korea - 22 Jan 2019)

AI, 5G to be major chip market growth driver, says SEMI CMO
(DigiTimes - 22 Jan 2019

SEMICON Korea 2019 showcases industry leaders offering a vision of the future of semiconductors
(Korea IT Times - 22 Jan 2019)

Intel Preps Multi-Billion Dollar Expansion Of Its Oregon Chip Fab
(Hot Hardware - 22 Jan 2019)

TSMC’s Outlook Underscores Foundry Market Challenges
(EE Times - 22 Jan 2019)

Qualcomm’s Stealth Program More ADAS than AV
(EE Times - 21 Jan 2019)

Power Issues Rising For New Applications
(Semiconductor Engineering - 21 Jan 2019)

DRAM Prices Forecast to Crash in Q1
(EE Times - 21 Jan 2019)

SK hynix donates W3b for vulnerable classes in Gyeonggi, North Chungcheong
(The Korea Hearld - 21 Jan 2019)

U.S. Lawmakers Propose Ban on Chip Sales to Huawei, ZTE
(EE Times - 18 Jan 2019)

Mostly Upbeat Outlook For Chips
(Semiconductor Engineering - 17 Jan 2019)

Foldables, DRAMs, and Other Puzzles
(EE Times - 17 Jan 2019)

Q'comm Exec: ‘Automotive Changed Our DNA’
(EE Times - 17 Jan 2019)

TSMC Offers Gloomy Revenue Forecast, Slams Chipmaker Shares
(U.S. News and World Reports - 17 Jan 2019)

TSMC: 7nm Now Biggest Share of Revenue
(AnandTech - 17 Jan 2019)

Developing Smarter, Safer Cars With ADAS IP
(Semiconductor Engineering - 16 Jan 2019)

AI’s Growing Impact On Chip Design
(Semiconductor Engineering - 16 Jan 2019)

Blog Review: Jan. 16
(Semiconductor Engineering - 16 Jan 2019)

Chasing Reliability In Automotive Electronics
(Semiconductor Engineering -15 Jan 2019)

AV Testing Advances Without Standards
(Semiconductor Engineering - 15 Jan 2019)

CES 2019: Enter a world of artificial intelligence
(The Straits Times - 15 Jan 2019)

CES 2019 Panel: Future of Transportation
(Electric VTOL News - 15 Jan 2019)

Despite uncertainty, long-term semiconductor market outlook remains bright
(Solid State Technology - 14 Jan 2019)

CES 2019 Panel: Future of Transportation
(Electric VTOL News – 15 Jan 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering – 11 Jan 2019)

Future shines bright for European photonics industry
(Solid State Technology - 10 Jan 2019)

Blood pressure watches, sleep tech and more: CES 2019 was all about health
(Kopitiam Bot - 10 Jan 2019)

CES marks the dawn of 5G technology
(RTE - 10 Jan 2019

Smart ovens, toilets and washing machines on display at CES 2019
(Ati Ito - 10 Jan 2019)

AMD Takes Center Stage at CES
(EE Times - 10 Jan 2019)

IoT Merging Into Data-Driven Design
(Semiconductor Engineering - 10 Jan 2019)

Making Autonomous Vehicles Safer
(Semiconductor Engineering - 10 Jan 2019)

IoT Device Security Makes Slow Progress
(Semiconductor Engineering 10 Jan 2019)

Chip Industry In Rapid Transition
(Semiconductor Engineering - 9 Jan 2019)

Blog Review: Jan. 9
(Semiconductor Engineering - 9 Jan 2019)

Samsung Warns of Weak Chip Demand
(EE Times - 9 Jan 2019)

STEM Effort Seeks Growth
(EE Times - 9 Jan 2019)

Semis Hope for Soft Landing
(EE Times - 8 Jan 2019)

Mainland China Wafer Production Capacity Growth Fastest in World
(Finanzen.ch - 7 Jan 2019)

AI Drives Next Wave of Chip Innovation and Growth
(Solid State Technology - 7 Jan 2010)

EDA, IP Show Strong Growth
(Semiconductor Engineering- 7 Jan 2019)

Quantum Issues And Progress
(Semiconductor Engineering - 7 Jan 2019)

5G Needs New Approach to Security
(EE Times - 7 Jan 2019)