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SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

Chips-as-a-Service on Startup’s Menu
(EE Times - 14 Mar 2019)

Power Budgets At 3nm And Beyond
(Semiconductor Engineering - 14 Mar 2019)

Global fab equipment spending to see 2019 decline before new highs in 2020
(Evaluation Engineering - 14 Mar 2019)

NTHU team makes major MRAM discovery
(Taipei Times - 14 Mar 2019)

Rogue Valley Microdevices: MEMS Foundry
(Semiconductor Engineering - 13 Mar 2019)

Blog Review: Mar. 13
(Semiconductor Engineering - 13 Mar 2019)

Is Analog Signal Processing the Future of AI?
(EE Times - 13 Mar 2019)

SEMI calls on industry leaders to confront diversity challenge
(Evaluation Engineering - 13 Mar 2019)

Global fab spending to fall 14% in 2019, rise 27% in 2020, says SEMI
(The Edge Markets - 13 Mar 2019)

Intel Set to Retake Top Spot in Semiconductor Sales
(Electronic Design - 13 Mar 2019)

Samsung risks being toppled by Intel in chip sector
(The Korea Herald - 12 mar 2019)

Finding Defects In Chips With Machine Learning
(Semiconductor Engineering - 12 Mar 2019)

AI Needs Memory to Get Cozier with Compute
(EE Times - 12 Mar 2019)

China power semi market grows 13%
(ElectronicsWeekly.com - 11 Mar 2019)

Renesas closes fabs as China demand collapses
(ElectronicsWeekly.com - 11 Mar 2019)

Nvidia to Buy Mellanox for $6.9 Billion in Data Center Push
(Bloomberg - 11 Mar 2019)

Intel, RISC-V Rally Rival Groups
(EE Times - 11 Mar 2019)

Intel to retake 'world's largest chipmaker' title back from Samsung as memory market declines
(TechSpot - 11 Mar 2019)

Structural Shifts in Semiconductor Industry Spawn New Trends
(TechNewsWorld - 8 Mar 2019)

SEMI FlexTech Announces Novel Interconnect, Integration Strategy Projects
(Printed Circuit Design & Fab - 8 Mar 2019)

Samsung Says It’s Shipping 28-nm Embedded MRAM
(EE Times - 8 Mar 2019)

AI: Where’s The Money?
(Semiconductor Engineering - 8 Mar 2019)

Huawei Sues the U.S. Government
(EE Times - 8 Mar 2019)

Cloud Computing Storms Ahead
(EE Times - 8 Mar 2019)

DRAM Prices in ‘Freefall’
(EE Times - 8 Mar 2019)

Renesas halts chip production at 13 plants as China demand flags
(Nikkei Asian Review - 6 Mar 2019)

Edge Intelligence Grabs the Spotlight at Embedded World
(EE Times - 6 Mar 2019)

Blog Review: Mar. 6
(Semiconductor Engineering - 6 Mar 2019)

Broadcom Ranked as No. 1 Fabless Chip Vendor
(EE Times - 5 Mar 2019)

ASMC 2019 Program Features Smart Manufacturing, Smart Innovations Printed Electronics Now
(Printed Electronics Now - 5 Mar 2019)

New Design Approaches At 7/5nm
(Semiconductor Engineering - 4 Mar 2019)

Innolux renewing fabs to shift focus
(Taipei Times - 4 Mar 2019)

Advanced Nodes Face Edge Errors
(EE Times - 4 Mar 2019)

Larger Memories to Boost Smartphones
(EE Times - 1 Mar 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering - 1 Mar 2019)

Industry association launches program that boosts tech talent
(Electronic Products and Technology - 1 Mar 2019)

New SEMI Task Force focuses on quality management to meet new, higher reliability standards
(Solid State Technology - 28 Feb 2019)

GlobalFoundries Moves Tools From Vermont to Germany
(U.S. News & World Report - 28 Feb 2019)

Chip Roadmap Looks Dark, Bumpy
(EE Times - 28 Feb 2019)

China’s Pursuit of Semiconductor Independence
(Center for Strategic & International Studies - 28 Feb 2019)

Edge Computing Wants Smarter IoT Devices
(EE Times - 27 Feb 2019)

Arm, Vodafone Formalize IoT Deal
(EE Times - 27 Feb 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering - 22 Feb 2019)

North American semi equipment industry posts January 2019 billings
(Evertiq - 22 Feb 2019)

Apple expected to deploy TSMC’s first 5nm ‘A14’ chips in 2020 iPhone
(MacDailyNews - 22 Feb 2019)

SK hynix moves to clear red tape for chip cluster
(The Korea Herald - 22 Feb 2019)

GlobalFoundries and Synopsys Develop Automotive-Grae IP for 22FDX Process Tech
(AnandTech - 22 Feb 2019)

SK hynix to build W120 tril. chip cluster in Yongin
(The Korea Times - 21 Feb 2019)

New Infineon Chairman Eder to Start in August
(U.S. News & World Report - 21 Feb 2019)

Mixed Outlook For Silicon Wafer Biz
(Semiconductor Engineering - 21 Feb 2019)

DARPA to Apply Electronics in Advanced Wound Treatment
(EE Times - 21 Feb 2019)

Using AI Data For Security
(Semiconductor Engineering - 20 Feb 2019)

IoT Was Interesting, But Follow the Money to AI Chips
(EE Times - 20 Feb 2019)

Toshiba Claims Highest-Capacity NAND
(EE Times - 20 Feb 2019)

Blog Review: Feb. 20
(Semiconductor Engineering - 20 Feb 2019)

A ride on the business cycle
(Solid State Technology -19 Feb 2019)

Qualcomm, Startup Roll 5G Silicon
(EE Times -19 Feb 2019)

Intel Buys Indian SoC Designer Ineda Systems
(EE Times - 19 Feb 2019)

GlobalFoundries Chip Fab Reportedly Being Shopped Around To Samsung And SK Hynix
(Hot Hardware - 19 Feb 2019)

Qualcomm's New 5G Modem and Radio Chips Should Help Fend Off Hungry Rivals
(The Street - 19 Feb 2019)

China Focus 1: Wally Rhines maps startup and design growth
(Tech Design Forum - 15 Feb 2019)

ePaper 2.0: Color and video come to electronic paper
(Solid State Technology - 15 Feb 2019)

Applied Materials Shares Slip on Dimmer Earnings Forecast
(The Street - 15 Feb 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering - 15 Feb 2019)

MEMS, sensors, automotive drive 200mm wafer processing
(EE News Europe - 14 Feb 2019)

200mm fabs to add 700,000 wafers through 2022, says SEMI
(DigiTimes - 14 Feb 2019)

Getting Ready For 32 GT/S PCIe 5.0 Designs
(Semiconductor Engineering - 14 Feb 2019)

Gearing Up For 5G
(Semiconductor Engineering - 14 Feb 19)

China's Chip Fab Capacity Rising Fast
(EE Times - 14 Feb 2019)

Global 200mm wafer processing on 3.9% CAGR
(EE News - 13 Feb 2019)

An update on TSMC's transition to 7nm EUV mass production and future plans
(TechSpot - 12 Feb 2019)

The “Wall,” political gridlock and China: SEMI’s take on SOTU address
(Solid State Technology - 12 Feb 2019)

200mm fabs to add 700,000 wafers through 2022, SEMI reports
(Solid State Technology - 12 Feb 2019

Trump Creates U.S. AI Initiative
(EE Times - 12 Feb 2019)

200mm Wafer Report Sees 14% Rise
(EE Times - 12 Feb 2019)

SEMI-FlexTech Issues 2019 Request for Proposals to Advance Flexible Electronics Ecosystem
(EMS Now -11 Feb 2019

Startup Accelerates AI at the Sensor
(EE Times - 11 Feb 2019)

5G’s Future Viewed from the Lab
(EE Times -11 Feb 2019)

IC Insights, SEMI far apart on significance of Chinese IC production
(EE News - 11 Feb 2019)

NIST: Blockchain Provides Security, Traceability for Smart Manufacturing
(NIST - 11 Feb 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering - 8 Feb 2019)

China's IC Production Forecast to Double Over Next 5 Years
(EE Times - 8 Feb 2019)

Flex Tech Effort Issues $5M Research Call
(EE Times - Feb 8 2019)

Apple, Qualcomm Fight Over Engineers
(EE Times - 7 Feb 2019)

The Race To Multi-Domain SoCs
(Semiconductor Engineering - 7 Feb 2019)

Complex Systems Need a Simple API
(EE Times -7 Feb 2019)

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council
(Solid State Technology - 6 Feb 2019)

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies
(Solid State Technology - 6 Feb 2019)

Huawei Was No. 3 Chip Buyer in 2018
(EE Times - 6 Feb 2019)

Samsung chief visits Xian seeking new memory strategy
(Korea Herald - 6 Feb 2019)

Intel Confirms Plans for Oregon Factory
(U.S. News & World Report - 5 Feb 2019)

Heterogeneous Integration Needs Tools, Models
(EE Times - 5 Feb 2019)

US Chipmakers Feel Pain When Wish Granted to Scrutinize China
(DataCenter Knowledge - 4 Feb 2019)

Chip Sales Slow, China Talks Start
(EE Times - Feb 4 2019)

Renesas to Cut 1,000 Jobs in Japan
(EE Times - 4 Feb 2019)

SEMI-FlexTech issues 2019 request for proposals to advance flexible electronics ecosystem
(Solid State Technology - 4 Feb 2019)

Skin-Like Biocompatible Devices Come to Market – and to FLEX/MSTCS
(Solid State Technology - 1 Feb 2019)

Uber Calls for AI Standard
(EE Times - 1 Feb 2019)

Japan to Hack 200 Million IoT Devices
(EE Times - 1 Feb 2019)

GlobalFoundries to Sell 200-mm Fab 3E to Vanguard, Exits MEMS Business
(AnandTech - 1 Feb 2019)

Samsung Electronics 4Q net profit slumps 31%
(Japan Today - 1 Feb 2019)

Smart Cars Drive 200mm Fabs
(EE Times - 31 Jan 2019)

Pushing AI Into The Mainstream
(Semiconductor Engineering - 31 Jan 2019)

Silicon shipments hit record high with revenues exceeding US$10 billion in 2018, says SEMI

(Digitimes - 31 Jan 2019)

Annual silicon shipments hit record high, market exceeds $10B for first time since 2008

(Solid State Technology - 30 Jan 2019)

Chip Gear Sales Fell in December
(EE Times - 29 Jan 2019)

Intel to Invest $10.9 Billion in New Israeli Fab
(EE Times - 29 Jan 2019)

China’s Foundry Biz Takes Big Leap Forward
(Semiconductor Engineering - 28 Jan 2019)

Here’s how tariff have impacted robotics and why it matters
(Tech Wire Asia - 28 Jan 2019)

Automotive-centric semiconductor players to drive tech sector
(The Edge Markets - 28 Jan 2019)

Augmented reality, IoT will transform manufacturing processes
(IIot World - 28 Jan 2019)

Weak China Demand Stings Intel
(EE Times - 25 Jan 2019)

China, Chips, and 2019 Still Unclear
(EE Times - 25 Jan 2019)

How to add machine intelligence or AI to EDA tools
(Solid State Technology - 25 Jan 2019)

Agile manufacturing of glass carriers for advanced packaging
(Solid State Technology - 25 Jan 2019)

A year of transformation and execution: Focus on creating member value
(Solid State Technology - 25 Jan 2019)

SEMICON Korea Highlights Smart Tech, Industry Growth and Workforce Development
(EMS Now - 24 Jan 2019)

What’s Next For AI, Quantum Chips
(Semiconductor Engineering - 24 Jan 2019)

Planning For 5G And The Edge
(Semiconductor Engineering - 23 Jan 2019

Blog Review: Jan. 23
(Semiconductor Engineering - 23 Jan 2019)

Chip Industry M&A Remains on the Decline
(EE Times - 23 Jan 2019)

The Data Deluge
(Semiconductor Engineering - 23 Jan 2019)

Planning For 5G And The Edge
(Semiconductor Engineering - 23 Jan 2019)

Samsung Electronics Increases Spending on Lobbying in the U.S.
(Business Korea - 22 Jan 2019)

AI, 5G to be major chip market growth driver, says SEMI CMO
(DigiTimes - 22 Jan 2019

SEMICON Korea 2019 showcases industry leaders offering a vision of the future of semiconductors
(Korea IT Times - 22 Jan 2019)

Intel Preps Multi-Billion Dollar Expansion Of Its Oregon Chip Fab
(Hot Hardware - 22 Jan 2019)

TSMC’s Outlook Underscores Foundry Market Challenges
(EE Times - 22 Jan 2019)

Qualcomm’s Stealth Program More ADAS than AV
(EE Times - 21 Jan 2019)

Power Issues Rising For New Applications
(Semiconductor Engineering - 21 Jan 2019)

DRAM Prices Forecast to Crash in Q1
(EE Times - 21 Jan 2019)

SK hynix donates W3b for vulnerable classes in Gyeonggi, North Chungcheong
(The Korea Hearld - 21 Jan 2019)

U.S. Lawmakers Propose Ban on Chip Sales to Huawei, ZTE
(EE Times - 18 Jan 2019)

Mostly Upbeat Outlook For Chips
(Semiconductor Engineering - 17 Jan 2019)

Foldables, DRAMs, and Other Puzzles
(EE Times - 17 Jan 2019)

Q'comm Exec: ‘Automotive Changed Our DNA’
(EE Times - 17 Jan 2019)

TSMC Offers Gloomy Revenue Forecast, Slams Chipmaker Shares
(U.S. News and World Reports - 17 Jan 2019)

TSMC: 7nm Now Biggest Share of Revenue
(AnandTech - 17 Jan 2019)

Developing Smarter, Safer Cars With ADAS IP
(Semiconductor Engineering - 16 Jan 2019)

AI’s Growing Impact On Chip Design
(Semiconductor Engineering - 16 Jan 2019)

Blog Review: Jan. 16
(Semiconductor Engineering - 16 Jan 2019)

Chasing Reliability In Automotive Electronics
(Semiconductor Engineering -15 Jan 2019)

AV Testing Advances Without Standards
(Semiconductor Engineering - 15 Jan 2019)

CES 2019: Enter a world of artificial intelligence
(The Straits Times - 15 Jan 2019)

CES 2019 Panel: Future of Transportation
(Electric VTOL News - 15 Jan 2019)

Despite uncertainty, long-term semiconductor market outlook remains bright
(Solid State Technology - 14 Jan 2019)

CES 2019 Panel: Future of Transportation
(Electric VTOL News – 15 Jan 2019)

Week In Review: Manufacturing, Test
(Semiconductor Engineering – 11 Jan 2019)

Future shines bright for European photonics industry
(Solid State Technology - 10 Jan 2019)

Blood pressure watches, sleep tech and more: CES 2019 was all about health
(Kopitiam Bot - 10 Jan 2019)

CES marks the dawn of 5G technology
(RTE - 10 Jan 2019

Smart ovens, toilets and washing machines on display at CES 2019
(Ati Ito - 10 Jan 2019)

AMD Takes Center Stage at CES
(EE Times - 10 Jan 2019)

IoT Merging Into Data-Driven Design
(Semiconductor Engineering - 10 Jan 2019)

Making Autonomous Vehicles Safer
(Semiconductor Engineering - 10 Jan 2019)

IoT Device Security Makes Slow Progress
(Semiconductor Engineering 10 Jan 2019)

Chip Industry In Rapid Transition
(Semiconductor Engineering - 9 Jan 2019)

Blog Review: Jan. 9
(Semiconductor Engineering - 9 Jan 2019)

Samsung Warns of Weak Chip Demand
(EE Times - 9 Jan 2019)

STEM Effort Seeks Growth
(EE Times - 9 Jan 2019)

Semis Hope for Soft Landing
(EE Times - 8 Jan 2019)

Mainland China Wafer Production Capacity Growth Fastest in World
(Finanzen.ch - 7 Jan 2019)

AI Drives Next Wave of Chip Innovation and Growth
(Solid State Technology - 7 Jan 2010)

EDA, IP Show Strong Growth
(Semiconductor Engineering- 7 Jan 2019)

Quantum Issues And Progress
(Semiconductor Engineering - 7 Jan 2019)

5G Needs New Approach to Security
(EE Times - 7 Jan 2019)