Joerg Recklies has been in the semiconductor industry for 26 years with responsibilities ranging from Chip design to IDM. He is currently in charge of the General Manager at Infineon Technologies Regensburg. Prior to that, Joerg Recklies was in charge of the FAB Manager at Infineon Dresden and held several positions in automation and productions at Infineon. These positions contributed to his excellent experience in terms of equipment and automation. Earlier in his carrier he has made contributions in digital and analog Chip design. Joerg Recklies holds a graduate engineer for Semiconductor.
Highlight during the time with Infineon
- Establish high automation at IFD 1995- 1997 as project leader automation
software integration
- Project Leader world wide cost reduction program within Infineon Frontend
Productions from 1999 –2003 (within Europe, US, Asia)
- Section Manager Plasma Etch / Wafer Inspection 2003- 2007
- Director Maintenance Engineering 2007 – 2014
- Project Leader 300 mm Fab Startup / Transfer Power Technologies 2011-2013
- FAB Manager Senior Director 200 / 300 mm Dresden 2014 – 2018
- General Manager Site Regensburg Senior Vice President since 2018
- Establish high automation at IFD 1995- 1997 as project leader automation
software integration
- Project Leader world wide cost reduction program within Infineon Frontend
Productions from 1999 –2003 (within Europe, US, Asia)
- Section Manager Plasma Etch / Wafer Inspection 2003- 2007
- Director Maintenance Engineering 2007 – 2014
- Project Leader 300 mm Fab Startup / Transfer Power Technologies 2011-2013
- FAB Manager Senior Director 200 / 300 mm Dresden 2014 – 2018
- General Manager Site Regensburg Senior Vice President since 2018