In this webinar on May 18, 2022, ASE’s Dr. Chris Huang placed a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.
The incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond.
Unique approaches required to overcome MEMS and Sensor packaging and test challenges were presented and how ASE has achieved the highest possible performance when responding and interacting with any external or environmental stimuli.