Monday, November 1, 2021
Global Policy Panel
The Geopolitical Connections Session will feature analysis of the major policy issues affecting the global semiconductor supply chain from the Eurasia Group, while the Global Policy Panel with Eurasia and the Washington D.C. office leads from top industry players will look at how they are approaching these issues and elaborate on the risks and opportunities present in today’s complex policy environment.
Moderator: Joe Pasetti, Vice President Global Public Policy and Advocacy, SEMI
Panelists:
- Peter Cleveland, Vice President, Global Policy, TSMC
- Meg Hardon, Vice President, Government Relations, Infineon Technologies Americas
- Peter Lichtenbaum, Partner, Covington & Burling
- Paul Triolo, Head Global Technology Policy, Eurasia Group