BIOGRAPHY
Dr. Yasumitsu Orii is an executive leader and technology innovator in advanced semiconductor packaging, with more than 35 years of experience spanning mainframes, laptops, HDDs, and next-generation server platforms. Dr. Orii joined IBM Japan in 1986 and became a recognized industry leader in flip-chip organic packaging technologies, contributing significantly to the performance enhancement, miniaturization, and reliability of IBM’s mainframe servers, laptop computers, and HDD products. As Moore’s Law approaches its practical limits, advanced packaging has become a critical enabler of future system performance, and he has been at the forefront of this technological evolution. Dr. Orii pioneered the application of flip-chip technology on flexible printed circuits (FPCs) for HDDs, enabling read/write amplifier ICs to be mounted directly on the suspension and positioned closer to the GMR head. This innovation significantly improved signal integrity and storage system performance. He later developed the proprietary C2 (Chip Connection) technology, enabling cost-effective 50 μm-pitch flip-chip bonding for high-volume consumer electronics applications. The technology was subsequently licensed to a leading company in Taiwan. At IBM Research Tokyo, he led strategic research and development programs in advanced organic packaging, 3D-IC integration, and neuromorphic computing technologies for future IBM server platforms. He also spearheaded joint development programs with leading Japanese materials companies, creating innovative technologies and accelerating their path to commercialization. Following his distinguished career at IBM, Dr. Orii joined the NAGASE Group, where he currently serves as an executive leader driving technology innovation and business creation. He established the New Value Creation Office, reporting directly to the President, to foster new business opportunities, strategic partnerships, and long-term growth through emerging technologies and innovation. He joined Rapidus Corporation in December 2022 and currently serves as Senior Managing Executive Officer and Head of the Chiplet Solutions Division. In addition to his industry leadership, Dr. Orii has served as a Visiting Professor at Hokkaido University since 2026, contributing to education and research in advanced semiconductor technologies.