OVERVIEW OF THE TEXAS SEMICONDUCTOR INNOVATION CONSORTIUM AND FUND
In 2023, the Texas Legislature passed House Bill 5174, which is commonly referred to as the Texas Chips Act. The Act created the Texas Semiconductor Innovation Consortium (TSIC), the TSIC Executive Committee, the Texas Chips Office to administer the program, and the Texas Semiconductor Innovation Fund (TSIF) with $698 M of state funding. The TSIC consists of 19 public universities that collaborate to address research and workforce needs. The TSIF receives applications for funding from both private entities and public universities. Applications are reviewed by staff, scored, and submitted to the full TSIC Executive Committee for approval. As of March, the TSIF had received 20 applications for funding from public universities and 50 applications from private entities, totaling $3.78 B. Projects continue to be reviewed, scored, approved, and move through the contracting process.
BIOGRAPHY
Dr. David E. Daniel is an engineering consultant in Dallas and President Emeritus of UT Dallas. Dr. Daniel chairs the Texas Semiconductor Innovation Consortium Executive Committee. He earned BS, MS, and PhD degrees in engineering from UT Austin. Between degrees, he worked for 3 years for an engineering company in San Francisco, and after earning his PhD degree, served on the engineering faculty at UT Austin for 16 years. From 1996 until 2005, he served as a Department Head and then as Dean of Engineering at the University of Illinois at Urbana-Champaign. From 2005 to 2015, Dr. Daniel was President of UT Dallas and thereafter served for three years as Deputy Chancellor and Chief Operating Officer of The University of Texas System. Dr. Daniel was elected to the National Academy of Engineering in 2000 and is past president of the Texas Academy of Medicine, Engineering, Science, and Technology.