Beyond Scaling: Silicon Photonics and MEMS breakthrough technologies for AI Infrastructure Era and Sensing
ABSTRACT
The AI revolution and the democratization of IoT devices require miniaturized technologies that follow the More-Moore scaling trend over time. A paradigm shift beyond scaling is also mandatory for technologies, devices and systems today developed for AI hardware and IoT devices. Indeed, to solve AI hardware bottlenecks regarding computing performance and data bandwidths, the development of new architectures at compute node level is a massive trend, featuring co-packaged computing, new chiplet architectures and next generations of optical interconnects. To answer the needs of next generations of IoT devices, with increased level of functions and complexity, a revolution of MEMS and Silicon photonic technologies is on-going for inertial, acoustic and bio-sensors fully-integrated on Silicon. This presentation will showcase several examples of leading-edge CEA-Leti technologies featuring advanced Silicon photonics and MEMS that aim to answer the current and future challenges of AI hardware and IoT devices.
BIOGRAPHY
With an initial formation and background in Materials Science and Engineering, Vincent Destefanis has worked for 5 years in the SEMI industry as a Front-End Engineer for STMicroelectronics and CEA-Leti. Vincent has mainly contributed to the development of 22 nm and sub-22 nm FD-SOI technologies, within the scope of the IBM industrial alliance at Albany, NY. Then, he worked for nearly 15 years in the infrared photonic industry, occupying various job positions at Lynred (formerly Sofradir, Veurey France). Initially as a R&D Engineer, then evolving to project and partnership management, Vincent has brought significant technical and project contributions to tens of institutional and industrial projects in the field of advanced imaging infrared technologies. Now working for the Optics and Photonics division of CEA-Leti, Vincent is promoting leading-edge CEA-Leti technologies worldwide, and is developing industrial and academic partnerships with Leti, in the fields of Silicon Photonics and optical sensing technologies.