The Edge AI Hardware race is heating up - how MEMS µcooling can solve one of the biggest barriers to increasing compute at the Edge
ABSTRACT
Edge AI hardware devices are caught in a vise: Processing demands are scaling exponentially but thermal budgets are not keeping pace. While data centers dedicate kilowatts to active cooling, Edge devices have traditionally relied entirely on passive solutions that consume no power and generate no airflow, all within sealed enclosures that leave millimeters of space for thermal management. Hardware manufacturers are facing a difficult problem – how do they bring new features and intelligence capabilities to the Edge if their existing cooling solution is maxed out?
In this presentation, xMEMS will explore the thermal bottleneck facing edge AI hardware markets and explain how a micro technology can have a macro impact. We will examine thermal challenges common to Edge-AI devices like skin contact and performance throttling, discuss how xMEMS piezo-based µCooling technology works, and show how we leverage its unique characteristics to solve thermal problems.
BIOGRAPHY
Kevin Hughes is a Senior Product Manager for Sensor Products at Infineon Technologies. In his current role, Kevin leads activities for Radar, Time of Flight, Environmental, Microphone and Pressure sensors. He is responsible for business development, product roadmap definition, coordination of system-level HW+SW solutions, and preparing regional go-to-market strategies for Consumer and Industrial markets. Prior to Infineon, Kevin led the development of automotive MEMS inertial sensor products at TDK InvenSense. Kevin completed his B.S. and M.S. in Mechanical Engineering at the University of Illinois at Urbana-Champaign.