13:15 – 13:30 Registration 13:30 – 14:00 Welcome & Call to Order 14:00 – 14:15 Review and Approval of Previous Meeting Minutes 14:15 – 14:30 SEMI Staff Report 14:30 – 15:00 Liaison Reports 15:00 – 15:20 Task Forces Reports
Silicon Carbide Substrate Task Force
GaN Task Force
SiC Epitaxial Wafer Task Force
15:20 – 15:40 Ballot Application
#7407 Test method for determining net carrier density profiles in silicon carbide epitaxial wafers by capacitance-voltage measurements with a mercury probe
#7408 Specification For Bonding Silicon Carbide Homoepitaxial Wafer
15:40 – 16:00 New SNARF Application
Test method for Geometry of Silicon Carbide Wafers by single side oblique incident Interferometer 16:00 – 16:20 New TF Application
Ga2O3 Task Force
16:20 – 16:25 Next Meeting Date & Locale 16:25 – 16:35 Group Photo 16:35 – 17:00 Core Member Application and Renew
Registration link:
If you plan to attend the meeting, please make sure to submit the form below by Thursday November 19, 2026.
Add to Calendar2026-11-24 13:30:002026-11-24 17:00:00SEMI Standards Compound Semiconductor Materials China TC Chapter Fall Meeting 202613:15 – 13:30 Registration13:30 – 14:00 Welcome & Call to Order14:00 – 14:15 Review and Approval of Previous Meeting Minutes 14:15 – 14:30 SEMI Staff Report14:30 – 15:00 Liaison Reports15:00 – 15:20 Task Forces Reports Silicon Carbide Substrate Task Force GaN Task Force SiC Epitaxial Wafer Task Force15:20 – 15:40 Ballot Application #7407 Test method for determining net carrier density profiles in silicon carbide epitaxial wafers by capacitance-voltage measurements with a mercury probe #7408 Specification For Bonding Silicon Carbide Homoepitaxial Wafer15:40 – 16:00 New SNARF Application Test method for Geometry of Silicon Carbide Wafers by single side oblique incident Interferometer16:00 – 16:20 New TF Application Ga2O3 Task Force16:20 – 16:25 Next Meeting Date & Locale16:25 – 16:35 Group Photo16:35 – 17:00 Core Member Application and Renew Registration link:If you plan to attend the meeting, please make sure to submit the form below by Thursday November 19, 2026.https://forms.cloud.microsoft/r/YrRXGWPLwm Microsoft Teams:Join on your computer or mobile apphttps://teams.microsoft.com/meet/249559340258784?p=FM4QnjiQHUz12oqPSlMeeting ID: 249 559 340 258 784Passcode: Qn6b2cf9ChinaSEMI.org[email protected]Asia/Shanghaipublic