BIOGRAPHY
David McCann is the Senior Vice President and Chief of Staff for Business Units at Amkor Technology. He previously spent four years in the photonics industry, overseeing the manufacturability of new technologies for high-volume production. He previously served as Vice President of Post Fab Operations and Development at GlobalFoundries for eight years, managing internal bump and probe factories, packaging and test development, supplier partnerships, supply chain qualification, and external production.
David also led the Flip Chip Business Unit at Amkor Technology for 11 years and directed flip chip assembly and product development at Biotronik, GmbH. He was a member of the ECTC Executive Committee for a decade and currently serves as Vice President of Technology on the IEEE Electronics Packaging Society Board of Governors.
David has delivered keynotes and technical papers at various conferences, including ECTC, IMAPS, Confab, and MEPTEC, and holds patents in RF and sensor packaging and interconnection. He holds a master's degree in engineering management from Santa Clara University and a bachelor's degree in ceramic engineering from the University of Illinois Urbana-Champaign.