Packaging Quality and Reliability in the Era of Chiplets

Course Description

Given the immense cost of AI products & platforms, an important and differentiating factor for a successful packaging technology supplier is offering stellar quality and reliability to preserve the value of the expensive silicon chiplets. This course introduces various aspects of demonstrating Quality and Reliability in semiconductor packaging. One way to guarantee stellar quality and reliability of products with new technologies is to overdesign them, but that can be very expensive. Alternatively, under-designing packages from a reliability perspective may be cheaper; however, it will likely trigger premature failures in the field, leading to higher ownership costs and frustration for customers. Optimizing this balance to deliver new technology and meet customer expectations requires drawing from experience (history), judicious use of simulations, augmenting with empirical data and, more importantly, engineering rigor to make the right technology decisions. 

This course will prepare the audience to tackle technical problems (related to failure mechanisms and product qualification) by providing a blueprint that aids in proving that the technology capabilities can meet the market demands. The participants will experience the concepts through hands-on exercises throughout the course. 

Learning Objectives

• A brief overview of semiconductor packaging. 

• Understand the fundamentals of quality and reliability principles. 

• Understand the concept of the bathtub curve and its use for Q&R optimization. 

• Introduce the philosophy, and practical elements, of product qualification. 

• Understand use conditions based on different markets like Automotive, Data Centers, Mobile, Space, etc.

• Understand different quality tests and reliability stress tests done for product qualification. 

• Get insight into typical failure mechanisms and failure analysis techniques. 

• Demonstrate how to perform life distribution analysis to characterize statistical behavior of failures.

• Introduction to acceleration models for predicting useful life of the package. 

• Hands-on exercises

   

Who Should Attend

This course is ideal for anyone seeking a better understanding of how quality and reliability evaluation s performed for semiconductor packaging. 

Instructors

Shalabh Tandon and Shubhada Sahasrabudhe

Qurius LLC