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July 27, 2026 - July 28, 2026

Failure Yield Analysis

The Failure Yield Analys course is an 8-hour webinar that is held for 4 hours each day. 

Pricing
  • Members: $599
  • Non-Members: $649
  • Students/Vets: $549

* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].

Time

8:00 am - 12:00 pm PDT

Add to Calendar 2026-07-27 08:00:00 2026-07-28 12:00:00 Failure Yield Analysis (Americas/EU) The Failure Yield Analys course is an 8-hour webinar that is held for 4 hours each day. PricingMembers: $599Non-Members: $649Students/Vets: $549* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected]. United States SEMI.org [email protected] America/Los_Angeles public
Location

United States

Failure Yield Analysis

Course Description 

The Failure Yield Analysis course is an 8-hour webinar held over two days, for 4 hours each day. This course offers an introduction to a variety of effective tools, as well as the overall process flow for locating and characterizing the defect responsible for the failure. Analysts are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like design, testing, technology, processing materials science, chemistry, and even optics. Failed devices and low yields can lead to customer returns and idle manufacturing lines, costing a company millions of dollars a day. This course is designed for every manager, engineer, and technician working in the semiconductor field, using semiconductor components and supplying tools to the industry. 

Course Objectives

  1. This seminar will provide participants with an overview of the tools, techniques, and processes used in failure and yield analysis.
  2. Participants will be able to determine how to proceed with a submitted request for analysis, ensuring that the analysis is done with the greatest probability of success.
  3. The seminar will identify the advantages and disadvantages of a wide variety of tools and techniques that are used for failure and yield analysis.

     

Course Topics

  • Introduction to Failure Analysis
  • Failure Analysis Principles/Procedures
  • Gathering Information
  • Package Level Testing
  • Electrical Testing
  • Decapsulation/Backside Sample Preparation
  • Die Inspection
  • Photon Emission Microscopy
  • Electron Beam Tools
  • Optical Beam Tools
  • Thermal Detection Techniques
  • Chip-Level Deprocessing
  • Analytical Techniques
  • Probing
  • Focused Ion Beam Technology

 

Chris Henderson 

Semitracks, Inc. 

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.