October 7, 2025
The rapid proliferation of AI, fueled by ever-larger models and data sets, has challenged future computing systems – they must deliver high performance extremely efficiently, using the least possible energy. This formidable challenge cannot be addressed in silos by individual companies or even industry segments. SEMI's Smart Data-AI Initiative is exploring collaborative and innovative system-level solutions that “connect the dots” across the entire ecosystem.
Time
10:30 am - 4:40 pm
Location
Phoenix, AZ
United States
As part of this process, this session brings together top executives from industry leaders across the entire value-chain spectrum – including device design & fabrication, interconnects & system integration, hyperscale architectures & algorithms, novel materials, as well as emerging disruptive technologies like photonics and quantum. Attendees will have the rare opportunity to get a strategic perspective from these distinguished experts about the state-of-the-art and learn about exciting future trends propelling the industry towards $1 Trillion in revenue.
Agenda
Session 1
Welcome Remarks and Session Overview
The Next-Generation Advanced Foundry: Accelerating 2nm & Advanced Packaging Innovation Through Global Collaboration
Keynote: Stanford University: Performance Limitations of Si CMOS and Alternatives for Nanoelectronics
Challenging the Status Quo: From Chip Innovation to Compute Optimization
AMD - Presentation Title TBD
Scaling AI - From Silicon to Systems
Session 1 Wrap-up
Session 2
Welcome Remarks and Session Overview
Next generation semiconductor to support AI resiliency
Merck KGaA, Darmstadt, Germany – The Glue Layer of Semiconductors: Powering Energy-Efficient Chips Through Advanced Materials
HPE Labs - Computing Futures from AI to Quantum to GenZ
Ciena - Presentation Title TBD
Rigetti - Presentation Title TBD
Quantum Economic Development Corporation (QEDC) - Presentation Title TBD