September 24, 2020
The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics. Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types. The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.
Time
10:00 am - 12:00 pm PDT
Location
United States
This Master Class is 3rd in a series of 4 classes. Classes 1 and 2 are available On Demand. Class 4 will be announced shortly.
#1 Flexible Power Sources: Challenges, Progress and Integration
#2 Artificial Intelligence in Thin Film Manufacturing
#4 Reliability Measurement and Test for Flexible Electronics
Featured Speakers
Registration Includes:
- Access to the recorded session for use by the same person, multiple times
- Additional attendees must register separately to view
Member Price: $25
Non-Member Price: $49
Non-Member Price for Government, Military, and Academia Non-Members: $35
To receive this price, contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address
Students: $0
To receive this price, contact Gity Samadi at [email protected] for discount code. Must have a valid student ID card.