September 23, 2021
SEMI International Standards Program
Compound Semiconductor Technology Forum
Thursday, September 23, 2021
09:30-17:00
Wuhu, Anhui, China
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509
Time
9:30 am - 5:00 pm
Add to Calendar
2021-09-23 09:30:00
2021-09-23 17:00:00
Compound Semiconductor Technology Forum
SEMI International Standards Program
Compound Semiconductor Technology Forum
Thursday, September 23, 2021
09:30-17:00
Wuhu, Anhui, China
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509
China
SEMI.org
[email protected]
America/Los_Angeles
public
Location
China
Agenda
8:50 am
-
9:20 am
Registration
9:20 am
-
9:40 am
Welcome Remark
9:40 am
-
9:55 am
Qing Zhao
Chairman of the Board
Wuhu Advanced Semiconductor Manufacturing Co., Ltd.
Introduction and Development Plan of Wuhu Advanced Semiconductor Manufacturing Co., Ltd & SiC MOSFET and GaN HEMT Technical Conference of WASMC
9:55 am
-
10:15 am
Jing Wang
Chief Scientist
Wuhu Advanced Semiconductor Manufacturing Co., Ltd.
Technology of SiC and GaN in Wuhu Advanced Semiconductor Manufacturing Co., Ltd.
10:15 am
-
10:45 am
Gan Feng
General Manager
Epiworld International Co., Ltd
Development and Industrialization of 150mm 4H-SiC Epitaxial Wafers
10:45 am
-
11:15 am
Aris Ma
CEO
AK Optics Technology Co. Ltd
Some Progress of Domestic Optical Inspection Systems for Compound Semiconductors
11:15 am
-
11:45 am
Jack Zhang
Vice General Manager
Hunan San’an
Key Technologies and Challenges in Large Diameter SiC Substrate Manufacturing
11:40 am
-
1:30 pm
Break
1:30 pm
-
2:00 pm
Yongxi Zhang
CEO
InventChip Technology Co., Ltd.
Towards Qualification of 1200V SiC MOSFET Process on 150mm Wafers
2:00 pm
-
2:30 pm
Yi Pei
Director of Device Technology
Dynax Semiconductor
GaN Device for 5G Communication Era
2:30 pm
-
3:00 pm
Yongfeng Liu
CEO
Beijing TSD Semiconductor Co., Ltd.
Applications of Polishing Technology in Compound Semiconductor Manufacture
3:00 pm
-
3:30 pm
Xing Zhang
CEO
Compound Semiconductor Manufacturing（Xiamen) Co., Ltd
Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
3:30 pm
-
4:00 pm
Kai Cheng
Board Chair/CEO
Enkris Semiconductor Inc.
Progress on GaN Epitaxial Technology for Novel Power Device
4:00 pm
-
4:30 pm
Youwen Zhao
Chief Scientist & Chief Engineer
Zhuhai DT Wafer-Tech Co., LTD
Mass Production Technology, Market and Development Trend of InP and GaSb Substrates
4:30 pm
-
5:00 pm
Liang Tian
Director of SiC Technology
NARI
Application of Silicon Carbide Power Device in Power Grid
REGISTRATION
Traffic Reminder
Venue: Xinhua Ballroom, 3F of HUALUXE Wuhu (No. 34 Changjiang South Road, Yijiang District, Wuhu City, Anhui Province)
- Venue to Huhu Railway Station 8.5 miles, 20 minutes’ drive.
- Venue to Wuhu Xuanzhou Airport 50 miles, 1 hour’ drives.
- Venue to Nanjing Lukou International Airport 100 miles, 1.5 hours’ drive.
- Venue to Hefei Xinqiao International Airport 180 miles, 3 hours’ drive.