Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.
In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we explored the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.
The webinar featured presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.